Inspur, China's biggest server brand, will be among the companies affected negatively by the escalating US-China trade war due to its dependence on US chip vendors including Intel...
Innolux is striving to further integrate and enhance its manufacturing capability for automotive displays, aiming to develop large-size models with high resolutions in multiple specifications...
Networking IC design specialist Realtek Semiconductor has reported consolidated revenue increased 8.85% sequentially to a record high of NT$17.34 billion (US$588.7 million) in the...
Soitec has announced a business agreement with Qualcomm Technologies on the supply of piezoelectric-on-insulator (POI) engineered substrates for 4G and 5G RF filters. Soitec's piezoelectric-on-insulator...
PCB maker Apex International has reported revenues surged 21.5% on year to NT$2.98 billion (US$101.4 million) in the second quarter of 2020, and revenues for the first half of the...
Taiwan's first-tier IC design houses, such as MediaTek, have demanded more capacity support from their foundry partners recently, according to industry sources.
TSMC has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips. Demand for such extremely costly chips may be limited, but TSMC looks...
Taiwan's PCB makers have turned cautious about their shipments for non-Apple handset applications in the second half of the year as most Chinese vendors have yet to give clear shipment...
TSMC, after launching 3D SoIC backend service, has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips and is expected to enter commercial...
Taiwan-based semiconductor equipment suppliers engaged in TSMC's supply chain are set to be among the beneficiaries of the foundry house's advanced process capacity expansion with...
As demand for locally-developed CPUs and GPUs in China continues rising amid the US trade sanctions against Chinese IT enterprises, Taiwan-based IC substrate suppliers are expected...
The board of directors of Taiwan Semiconductor Manufacturing Company (TSMC) has approved plans to issue NT$13.9 billion (US$471.7 million) in unsecured bonds to help purchase new...
Adoption of e-SIM technology is expected to be driven mainly by handset applications in the next few years as consumers can switch their telecom service providers easily with the...
In the competitive smartphone maket, product differentiation is one of the crucial factors to attract customers. Handset vendors are now looking to customized chips to achieve such...
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