APCB, after experiencing lackluster revenue and profit performances in the first half of 2019, expects to perform better in the second half on increased shipments of high-end DRAM...
Intel in May unveiled plans to launch its 7nm products in 2021, and it is now stepping up efforts towards achieving that goal. It has started placing equipment and materials orders...
MediaTek is on track to enter volume production of its first 5G SoC for sub-6GHz networks in January 2020, having begun sampling the chips in the third quarter of 2019, according...
Several leaders from semiconductor firms and organizations have paid a visit to Taiwan's president Tsai Ing-wen, asking the government to tackle the two biggest issues facing the...
HannStar Display expects its sales for the fourth quarter of 2019 to rise sequentially, buoyed by strong demand for handset panels from Chinese vendors, according to company vice...
Billings among North American manufacturers of semiconductor production equipment dropped both sequentially and on year in August 2019, but stayed above US$2 billion, according to...
After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first eight months of 2019, according to IC Insights.
The worldwide market for high-density interconnect (HDI) PCBs came to more than US$10 billion in production value in 2018, with Taiwan accounting for about 40% of the total value,...
Intel has started placing equipment and materials orders for EUV fabrication processes since August, and is stepping up its pace of orders, according to industry sources.
The global semiconductor sector will experience constant quantitative and qualitative changes in the next 20-30 years, and heterogeneous integration will not be confined to CPU and...
Some may think Moore's Law is reaching its limits, but for TSMC, it is still very much alive. The world's number one pure-play foundry is already conducting 3nm...
The Foxconn Group's development direction in the semiconductor industry will primarily focus on vertical integration, aiming to become a solution provider and devoting its investments...
Innolux has teamed up with Taiwan's government-sponsored Industrial Technology Research Institute (ITRI) to develop fan-out panel-level packaging (FOPLP) technology, which will be...
China-based semiconductor firms are keenly luring talent away from chipmakers in Taiwan and South Korea by offering much higher pays, seeking to shorten time for technology development...
TPCA Show 2019 will take place October 23 to October 25, 2019 at the Taipei Nangang Exhibition Center Hall 1 (TaiNEX 1). Themed on "5G Next," this year's exhibition will focus on...
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