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Key components news coverage
IN THE NEWS
Wednesday 17 April 2019
CCL firm Ventec listed on TWSE, poised to grab 5G opportunities
Ventec International, a supplier of copper clad laminates (CCL), has officially got listed on the Taiwan Stock Exchange (TWSE) on April 17 as the fourth listed Taiwanese CCL supplier,...
Wednesday 17 April 2019
AMD intros Ryzen Embedded R1000 SoC to Taiwan
AMD has announced the latest member of its Ryzen Embedded product family, the new R1000 SoC series, which is ideal for applications in digital displays, high-performance edge computing,...
Wednesday 17 April 2019
KYEC, Qualcomm said to set up 5G chips engineering test center
Backend house King Yuan Electronics (KYEC) reportedly will team up with Qualcomm to set up an engineering test center to be installed with 20-30 sets of equipment for testing 5G radio-frequency...
Wednesday 17 April 2019
Intel to exit 5G smartphone modem business
Intel has announced its intention to exit the 5G smartphone modem business and complete an assessment of the opportunities for 4G and 5G modems in PCs, internet of things devices...
Wednesday 17 April 2019
TSMC unveils 6nm process
Taiwan Semiconductor Manufacturing Company (TSMC) has announced its 6nm (N6) process, which provides a significant enhancement from its 7nm (N7) technology and offers customers a...
Tuesday 16 April 2019
Samsung announces 5nm EUV development
Samsung Electronics has announced that its 5nm FinFET process technology is complete in its development and is ready for customers' samples.
Tuesday 16 April 2019
Semiconductor photomask sales reach record high of US$4 billion, says SEMI
Following a record-breaking 2017, worldwide semiconductor photomask sales set a new high of US$4.04 billion in 2018, according to SEMI.
Tuesday 16 April 2019
CHPT successfully tapping into satellite PCBs segment
Taiwan-based IC testing solution provider Chunghwa Precision Test Tech (CHPT) will see efforts in developing its new product line of aerospace PCBs pay off gradually, as its PCBs...
Tuesday 16 April 2019
Chip demand for more-than-Moore devices picking up
Chip demand for more-than-Moore device applications has been picking up, lifting 8-inch fab utilization rates at a rapid pace recently, according to industry sources.
Monday 15 April 2019
Japan makers retreating from flat panel industry
A recent announcement stating that Japan Display (JDI) has struck a deal to accept a JPY60 billion (US$535.98 million) investment from a consortium formed by Taiwan- and China-based...
Monday 15 April 2019
IC materials distributors see stable revenue increases in 1Q19
Taiwan-based distributors of semiconductor materials have posted revenue increases in the first quarter of 2019, mainly driven by ramp-up in demand for high-end chips for 5G, AI and...
Monday 15 April 2019
Samsung set to lose semiconductor market lead in 2019
Samsung Electronics increased its lead as the No. 1 semiconductor vendor due to the booming DRAM market in 2018, according to Gartner. However, the memory chip giant is likely to...
Monday 15 April 2019
Shennan Circuits posts strong 1Q19 results on 5G PCB shipments
China-based PCB maker Shennan Circuits has reported revenues of CNY2.163 billion (US$322.49 million) and net earnings of CNY187 million) for the first quarter of 2019, shooting up...
Monday 15 April 2019
TSMC reportedly to enter 7nm EUV production in 2Q19
Taiwan Semiconductor Manufacturing Company (TSMC) is set to move 7nm EUV process technology to volume production in the second quarter of 2019, according to a recent Chinese-language...
Monday 15 April 2019
Sony maintains lead in diverse O-S-D market
Companies selling optoelectronics currently dominate the ranking of the top-10 O-S-D (optoelectronics, sensors/actuators and discretes) suppliers, according to IC Insights. Nine of...