Taiwan Semiconductor Manufacturing Company (TSMC) held a ceremony on October 31 to mark the opening of its 12-inch wafer plant in Nanjing, China. Company chairman Mark Liu and CFO...
Taiwan-based major MCU makers including Holtek Semiconductor expect their shipments for the fourth quarter of 2018 to be affected by the uncertainty in terminal market demand amid...
Eight-inch foundry Vanguard International Semiconductor (VIS) has expressed caution about the IC market growth in 2019, citing the impact of the escalating US-China trade war and...
ASE Technology Holding, the parent company of IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), expects to post another sequential...
Rohm Semiconductor aims to ramp up its revenues generated from the industrial sector to 15% in the next three years as it is striving to roll out efforts to compete against larger...
As its processor supply continues to fall short of demand, Intel reportedly has begun planning to outsource production for its entry-level Atom processors and some of its chipsets...
Flexible PCB (FPCB) specialist Flexium Interconnect has reported earnings per share of NT$3.22 (US$0.11) for the third quarter of 2018, when net profits hiked over 500% sequentially...
Worldwide production capacity for large-size (9-inch and above) TFT LCD panels is projected to rise over 9% annually through 2020 resulting from continued capacity expansions by China-based...
While Intel and Nvidia have developed leading presence in the CPU and GPU fields, respectively, Xilinx has demonstrated solid innovation prowess in the FPGA space, constantly expanding...
Micron Technology has announced the opening of a new plant in Taichung, central Taiwan that will be dedicated to providing backend services for the manufacture of DRAM memory.
At the Open Innovation Platform (OIP) Ecosystem Forum held in early October, Taiwan Semiconductor Manufacturing Company (TSMC) announced the launch of OIP Virtual Design Environment...
Himax Technologies and Kneron, an artificial intelligence (AI) startup company, have jointly announced a collaboration to accelerate the development and commercialization of a high...
Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...
Globalfoundries and the Chengdu municipality have signed an amendment to their investment and cooperation agreement. Based on market condition changes, Globalfoundries' renewed focus...
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