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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Friday 22 June 2018
ASE Industrial striving for diversification
ASE Industrial holding, the parent company of Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), will be diversifying its offerings to satisfy growing...
Friday 22 June 2018
Innolux to spearhead in mini LED panel sector
Innolux has showcased recently its active matrix (AM) mini LED-based PID (public information display) devices and other large-size display products, aiming to begin commercial shipments...
Friday 22 June 2018
Internal entrepreneurship to be key for Taiwan innovation development, said NTU professor Gary Wang
Thanks to his 20 years of work in Silicon Valley, Gary Wang, a professor of the Creativity & Entrepreneurship Program at National Taiwan University (NTU), co-founder and chairman...
Friday 22 June 2018
TV panel prices stabilizing
Prices of TV panels have stabilized recently thanks to the approaching traditional peak season that begins in the third quarter. The price drops for large-size TV panels will slow...
Friday 22 June 2018
TSMC likely to make Qualcomm 7nm Snapdragon chips
Speculation has been circulating that Qualcomm will return to TSMC for 7nm. Industry sources believe that the foundry with its 7nm FinFET process node will win back its major contract...
Friday 22 June 2018
China AI unicorns grow stronger on fresh financial injections
China's AI sector has witnessed a new round of fundraising campaigns, with a flurry of investment deals completed over the past few weeks to make AI unicorns there stronger, according...
Friday 22 June 2018
Intel CEO Brian Krzanich resigns
Intel has announced the resignation of Brian Krzanich as CEO and a member of the board of directors. The board has named chief financial officer Robert Swan interim CEO, effective...
Friday 22 June 2018
TSMC ramping up 7nm chip production
Taiwan Semiconductor Manufacturing Company (TSMC) has started commercial production of chips built using 7nm process technology, according to company CEO CC Wei. The foundry is also...
Friday 22 June 2018
TSMC develops SiP technology
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.
Thursday 21 June 2018
North American semi equipment industry posts record billings for 2nd consecutive month
North America-based manufacturers of semiconductor equipment posted US$2.70 billion in billings worldwide in May 2018 (three-month average basis), according to SEMI. The billings...
Wednesday 20 June 2018
Edge AI solutions provider Kneron aspires to become innovation leader
Taiwan's edge AI solutions provider Kneron has recently completed its series A1 financing of US$18 million led by Horizons Ventures, a venture capital firm founded by Hong Kong tycoon...
Tuesday 19 June 2018
Competition for in-display fingerprint sensor market heating up, says Digitimes Research
Competition in the in-display fingerprint sensor market is heating up as more IC design-houses, smartphone vendors and other companies are jumping into the bandwagon in order to get...
Tuesday 19 June 2018
Shunsin reportedly earns new 3D sensing module orders
Shunsin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, has obtained new orders...
Tuesday 19 June 2018
MediaTek steps up investment in 5G, AI
Smartphone SoC specialist MediaTek plans to pour in additional investments to its advanced technology R&D as the company expects to speed up deployments in emerging sectors such...
Tuesday 19 June 2018
FPCB firm Flexium looks to double-digit revenue growth in 2018
Taiwan-based flexible PCB (FPCB) maker Flexium Interconnect expects to enjoy another year of double-digit revenue growth in 2018.