More than 50 IC designers, academic units and research bodies in China have recently established the China RISC-V Industry Consortium, seeking to develop the country's independent...

Fitipower Integrated Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in LCD driver ICs, started trading on the mainboard of the Taiwan Stock...

China-based flat panel makers Chongqing HKC Optoelectronics Technology (HKC) and China Electronics Corporation (CEC) both reportedly have held off on their original plans to build...

Taiwan Semiconductor Manufacturing Company (TSMC) is set to tape out more than 50 chip designs with its 7nm process technology by the end of 2018, and over 100 chip designs with both...

Taiwan-based IC design houses are expected to post over 10% sequential decreases in October revenues, as shipments during the first week of the month were affected by China's National...

CMOS image sensor demand (CIS) is set to boom for application to triple-lens camera phones and automotive electronics in 2019, prompting leading CIS maker Sony to expand capacity...

With tremendous growth of smartphones over the past decade, foundry sales to the communications market have soared and are now forecast to account for about 3x more than IC foundry...

Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources.

At its recent forum in Beijing, Xilinx introduced its FPGA-based acceleration solutions designed for artificial intelligence (AI) and data center applications. Dubbed Alveo, the acceleration...

Qualcomm Technologies has announced a family of 60GHz Wi-Fi chipsets, the QCA64x8 and QCA64x1, delivering 10+ gigabit-per-second (Gbps) network speeds and wire-equivalent latency.

Samsung Electronics has started wafer production of its 7nm LPP with extreme ultraviolet (EUV) lithography technology, according to the company.

Worldwide shipments of polished and epitaxial silicon wafers are forecast to total 12.445 billion square inches in 2018, exceeding the market high set in 2017, according to SEMI....

MediaTek is expected to roll out its new Helio P70 mobile SoC built using a 12nm process technology later in October, aiming to maintain the shipment momentum of its mobile chips,...

Taiwan-based Flexium Interconnect and Unimicron Technology have both been fined for violating environmental regulations in Kunshan, China.

CEATEC Japan 2018 opened on October 16, with the four-day event showcasing the country's growth strategies and Society 5.0, its vision of a super-smart community of the future in...