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Key components news coverage
IN THE NEWS
Friday 8 June 2018
TSMC accelerating 7nm process production plan to meet demand
Taiwan Semiconductor Manufacturing Company (TSMC) is likely to move its 7nm process technology to mass production ahead of schedule to meet growing demand from its fabless clients...
Friday 8 June 2018
Applied Materials breakthrough accelerates chip performance in big data and AI era
Applied Materials has announced a breakthrough in materials engineering that accelerates chip performance in the big data and AI era.
Thursday 7 June 2018
Samsung NEXT to invest in startups with decentralized applications
Samsung NEXT, a multifaceted innovation group within Samsung Electronics, is actively seeking investment targets in the fields of AI, IoT, AR/VR, blockchain, smart healthcare data...
Thursday 7 June 2018
CPT revenues up in May despite decreased panel shipments
Chunghwa Picture Tubes (CHT) has reported consolidated revenues of NT$2.308 billion (US$77.68 million) for May, up 4.9% on month but down 3.9% on year.
Thursday 7 June 2018
TPK, GIS report mixed revenues for May
Touch panel makers General Interface Solution (GIS) and TPK Holding have reported mixed revenues for May with the former seeing its sales trending upward on renewal orders of existing...
Thursday 7 June 2018
MediaTek to intro enhanced version of Helio P60 AI chip in 2H18
MediaTek is expected to introduce an enhanced version of its Helio P60 SoC designed for midrange smartphones that come with artificial intelligence (AI) features in the second half...
Thursday 7 June 2018
Novatek May revenues hit 40-month high
Fabless LCD driver IC firm Novatek Microelectronics saw its revenues hit a 40-month high of NT$4.57 billion (US$153.6 million) in May 2018.
Thursday 7 June 2018
Chengdu Xingu eyes annual revenues of CNY200 billion by 2030
Chengdu Xingu Industrial Parks, a mega complex located in Shuangliu District of the largest city in the midwestern area of China, is moving at full throttles to build semiconductor...
Thursday 7 June 2018
Zhen Ding expects to post record high revenues in 2018
Flexible PCB (FPCB) maker Zhen Ding Technology expects to see its monthly revenues register on-year increases through October, according to company chairman Charles Shen. Revenues...
Thursday 7 June 2018
Unigroup Spreadtrum RDA to roll out 8-core 5G chip in 2019
Unigroup Spreadtrum & RDA plans to roll out its 8-core 5G chip for smartphones at the end of 2019, said company CEO Adam Zeng at a recent semiconductor forum held in Beijing.
Thursday 7 June 2018
Intel Atom x7-E3950 SBC supports extended temperatures
IBASE Technolog, a world leading manufacturer of industrial motherboards and embedded systems, has announced the IB818 3.5-inch SBC that can be powered by the Intel Atom QC x7-E3950,...
Wednesday 6 June 2018
Chang expresses trust in new TSMC leadership as he bids farewell
Morris Chang said at TSMC's annual shareholders meeting on June 5 that he believes the dual leadership of Mark Liu and CC Wei will create another "miraculous" growth for the pure-play...
Wednesday 6 June 2018
MediaTek releases 5G modem chips set for shipment in 2019
MediaTek has newly released its 5G modem chipset solution, the Helio M70, to be fabricated using TSMC's 7nm process incorporating EUV technology, and will kick off official shipments...
Wednesday 6 June 2018
Intel remains committed to pushing boundaries of PC
In the transition to the data-centric era, the PC remains a critical facet of Intel's business, and it is an area where the company believes there are still so many opportunities...
Wednesday 6 June 2018
Qualcomm announces Snapdragon 850 Mobile Compute Platform for Windows 10 PCs
At Computex, Qualcomm has announced at a joint effort with Samsung Electronics to integrate its Snapdragon 850 Mobile Compute Platform, featuring the Snapdragon X20 and Qualcomm AI...