Austria-based ams and China-based Ningbo Sunny Opotech, an optical image system solution provider, have announced a collaboration to jointly develop and market 3D sensing camera solutions...

Android smartphone vendors including Huawei, Oppo and Xiaomi Technology are expected to equip 3D sensing functionality to their new models slated for launch in 2018, according to...

Analog IC firm Anpec Electronics expects growing sales of its fan motor driver ICs to be a major revenue growth driver for the company in 2018.

Despite the recent market rumors indicating that Samsung Electronics may stop using heat pipes for its new smartphones in 2018, sources from upstream supply chain players have pointed...

Artificial intelligence (AI) will bring huge business opportunities and challenges for Taiwan's semiconductor industry, and the industry will face fierce competition from China, where...

Semiconductor Manufacturing International Corp (SMIC), China's largest foundry, will kick off volume production of 14nm FinFET process technology in 2019 and launch its second-generation...

MediaTek is aggressively persuading China smartphone vendors to adopt its Helio P processors to reduce risks of heavy reliance on Qualcomm, whose operations might be affected by Broadcom's...

Speculation circulated recently in the chipmaking industry that Taiwan Semiconductor Manufacturing Company (TSMC) is gearing up for 7nm chip production for Apple's in-house designed...

Taiwan-based IC design service company Global Unichip has announced a successful TCAM compiler tape-out based on TSMC's 16FFC process technology.

Taiwan-based second-tier touch panel makers have seen their profit margins improve recently as their efforts to penetrate into the niche and industry segments have begun bearing fruit,...

IC design house ALi, which specializes in set-top box (STB) chipset solutions, has reported a seventh consecutive quarterly loss in the third quarter of 2017 in which net losses came...

In the second quarter of 2017, Intel remained the market leader in pure semiconductor revenues, generated by the sale of its own products, according to IHS Markit. But the leadership...

After spending US$11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to US$26 billion...

Globalfoundries (GF) and Fudan Microelectronics Group have announced they have produced a next generation dual interface CPU card, using GF's 55nm low power extended (55LPx) technology...

With flexible AMOLED panel fabs building at a quicker pace than global demand, supply capacity of flexible AMOLED panels is forecast to be 44% higher than global demand in 2018, according...