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Wednesday 15 November 2017
China IC firm sets milestone with rollout of 3D NAND flash
Yangtze River Storage Technology (YMTC) under the Tsinghua Unigroup has successfully developed 32-layer 3D NAND flash chips, marking a new milestone and major technological breakthrough...
Wednesday 15 November 2017
HiSilicon selects Cadence Tensilica Vision P6 DSP for Kirin 970
Cadence Design Systems has announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence Tensilica Vision P6 DSP for its 10nm Kirin 970...
Tuesday 14 November 2017
WPG reports mild on-year increase in October revenues
WPG Holdings has reported consolidated revenues of NT$45.533 billion (US$1.51 billion) for October 2017, representing a 11.17% drop on month and 2.8% increase on year.
Tuesday 14 November 2017
Synopsys extends help for Taiwan AI development
Synopsys has signed a letter-of-intent (LOI) with a Taiwan government-run research lab to form a strategic partnership to help the country develop an artificial intelligence (AI)...
Tuesday 14 November 2017
Zhen Ding expects strong PCB demand to last till 1Q18, says chairman
Taiwan-based PCB maker Zhen Ding Technology is seeing strong demand in the fourth quarter of 2017 and expects the momentum to continue in the first quarter of 2018, according to company...
Tuesday 14 November 2017
Qualcomm rejects Broadcom acquisition bid
Qualcomm has announced that its board of directors has unanimously rejected the unsolicited proposal announced by Broadcom Limited ("Broadcom") on November 6, 2017, saying the bid...
Tuesday 14 November 2017
HY Electronic to acquire major stake in TGI
Power discrete component supplier HY Electronic specializing in diode products has disclosed plans to acquire a 70% stake in Taiwan GPP (TGI) for NT$350 million (US$11.52 million).
Monday 13 November 2017
Qualcomm signs purchase MoUs with China smartphone vendors
Qualcomm has announced that it has signed three non-binding memoranda of understanding (MoU) wherein Xiaomi Technology, Oppo Mobile Telecommunications and Vivo Communication Technology...
Monday 13 November 2017
Android camp reportedly seeking to renegotiate royalties with Qualcomm
The Android camp could follow the steps of Apple to temporarily suspend royalty payments to Qualcomm aiming to force the US-based chip vendors back to the negotiating table to work...
Monday 13 November 2017
Qualcomm and Alibaba showcase cloud-to-device integration to help drive LTE IoT in China
Qualcomm has announced that its subsidiary, Qualcomm Technologies, and Alibaba have ported Alibaba Cloud Link One to run on the Qualcomm MDM9206 global multi-mode LTE IoT modem. This...
Friday 10 November 2017
Andes Technology joins Globalfoundries FD-SOI ecosystem
Processor IP provider Andes Technology has teamed up with Globalfoundries to provide low-power solutions for the foundry's 22nm FD-SOI process technology to jointly deepen their deployment...
Friday 10 November 2017
Taiwan IC designers vying for 8-inch foundry supply
Taiwan fabless IC firms are aggresively vying to secure capacity at 8-inch foundries to meet increasing orders in 2018, particularly for MCU and MOSFET chips needed to support a variety...
Friday 10 November 2017
UMC posts record October revenues
Pure-play IC foundry United Microelectronics (UMC) has announced consolidated revenues of NT$13.81 billion (US$457.6 million) for October 2017, rising 16.4% sequentially and hitting...
Friday 10 November 2017
FocalTech optimistic about TDDI chip demand for all-screen devices in 2018
Full in-cell display module makers have been improving yield rates to lower their production costs for all-screen panels, which will see wider adoption by smartphones and tablets...
Thursday 9 November 2017
China-based Zhaoxin Semiconductor expects CPU sales to double in 2017, 2018
Zhaoxin Semiconductor, a leading China maker of x86 processors, expects its annual CPU sales to double for two consecutive years in 2017-18 due to its successful penetration into...