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IN THE NEWS
Friday 22 September 2017
Globalfoundries to roll out 12nm FinFET technology for high-performance devices
Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...
Thursday 21 September 2017
VIA sees rising income from embedded product lines
VIA Technologies has been pushing its embedded platform business and now sees 30-40% of its revenues coming from the segment, according to the company.
Thursday 21 September 2017
TSMC to hold over 70% of PWM IC orders from Qualcomm
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to grab 70-80% of the total orders for Qualcomm's new-generation power management ICs (PWM IC), according to industry...
Wednesday 20 September 2017
Touch Taiwan 2017: GIS, Young Fast demonstrating touch panel technologies
Taiwan's leading touch panel solution providers, including General Interface Solution (GIS) and Young Fast Optoelectronics, are exhibiting their latest touch panel solutions at the...
Wednesday 20 September 2017
PCB firm Unitech president steps down
Unitech Printed Circuit Board president Hsu Cheng-hung has stepped down to take responsibility of a fatal accident that occurred at its Yilan plant in June 2017, according to the...
Wednesday 20 September 2017
Synopsys tapes out DesignWare, Interface IP for TSMC 7nm FinFET process
Synopsys has announced the successful tape-out of a broad portfolio of DesignWare Foundation and Interface PHY IP for TSMC's 7nm process technology, including logic libraries, embedded...
Wednesday 20 September 2017
NAND flash supply to stay tight til end-2017, says Phison chairman
The supply of NAND flash memory is expected to remain tight through the end of 2017, according to Khein Seng Pua, chairman of flash device controller supplier Phison Electronics.
Wednesday 20 September 2017
Intel provides 10nm updates, plan for 10nm FPGA
Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...
Tuesday 19 September 2017
Edom 3Q17 revenues to increase over 20% sequentially
Edom Technology, which distributes products for chip vendors such as Nvidia and Skyworks, is expected to report over 20% revenue growth sequentially for the third quarter of 2017,...
Tuesday 19 September 2017
Touch Taiwan 2017: Innolux to highlight gaming notebook panels
In response to the growing global gaming market, Innolux will showcase a series of gaming notebook/monitor panels at the upcoming Taiwan Touch 2017 to be held at the Nangang Exhibition...
Tuesday 19 September 2017
SMIC, Brite and Synopsys team up for IoT platform
Semiconductor Manufacturing International (SMIC), Brite Semiconductor and Synopsys have teamed up to develop a platform that enables designers, system integrators and OEMs to accelerate...
Tuesday 19 September 2017
GigaDevice signs wafer supply contract with SMIC
China-based GigaDevice Semiconductor, a maker of flash memory devices and microcontroller (MCU) chips, has signed a strategic agreement on the supply of wafers worth about CNY1.2...
Monday 18 September 2017
AI processor emerging as new opportunity for China, says expert
Artificial intelligence (AI) processors will constitute a new opportunity for development in China, as AI applications are emerging rapidly to trigger a new round of demand in AI...
Monday 18 September 2017
Talent counts most in China IC development, says former SMIC CEO
The most critical key to achieving a breakthrough in the development of China's semiconductor industry rests with talent, instead of funds, markets or government policy support, according...
Monday 18 September 2017
MediaTek to unveil 5G prototype chip by end-2017
MediaTek is expected to complete development of its 5G prototype chip by the end of 2017, and is gearing up for trials of its 5G solutions in 2018, according to industry sources.