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Thursday 16 November 2017
SMIC to start volume production of 14nm FinFET process in 2019
Semiconductor Manufacturing International Corp (SMIC), China's largest foundry, will kick off volume production of 14nm FinFET process technology in 2019 and launch its second-generation...
Thursday 16 November 2017
MediaTek touts Helio P in China amid Qualcomm speculation
MediaTek is aggressively persuading China smartphone vendors to adopt its Helio P processors to reduce risks of heavy reliance on Qualcomm, whose operations might be affected by Broadcom's...
Thursday 16 November 2017
Next-gen iPad Pro to feature 7nm A11X chip, says report
Speculation circulated recently in the chipmaking industry that Taiwan Semiconductor Manufacturing Company (TSMC) is gearing up for 7nm chip production for Apple's in-house designed...
Thursday 16 November 2017
Global Unichip tapes out 16nm TCAM compiler
Taiwan-based IC design service company Global Unichip has announced a successful TCAM compiler tape-out based on TSMC's 16FFC process technology.
Thursday 16 November 2017
Taiwan 2-tier touch panel makers see profit margins improving
Taiwan-based second-tier touch panel makers have seen their profit margins improve recently as their efforts to penetrate into the niche and industry segments have begun bearing fruit,...
Thursday 16 November 2017
ALi posts another quarter of losses
IC design house ALi, which specializes in set-top box (STB) chipset solutions, has reported a seventh consecutive quarterly loss in the third quarter of 2017 in which net losses came...
Thursday 16 November 2017
Samsung overtakes Intel as semiconductor leader in 3Q17, says IHS
In the second quarter of 2017, Intel remained the market leader in pure semiconductor revenues, generated by the sale of its own products, according to IHS Markit. But the leadership...
Thursday 16 November 2017
Samsung huge chip capex for 2017 shows move to defend its memory dominance
After spending US$11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to US$26 billion...
Thursday 16 November 2017
Globalfoundries, Fudan to deliver next generation dual interface smart card
Globalfoundries (GF) and Fudan Microelectronics Group have announced they have produced a next generation dual interface CPU card, using GF's 55nm low power extended (55LPx) technology...
Wednesday 15 November 2017
Flexible AMOLED supply capacity to exceed demand by 44% in 2018, says IHS Markit
With flexible AMOLED panel fabs building at a quicker pace than global demand, supply capacity of flexible AMOLED panels is forecast to be 44% higher than global demand in 2018, according...
Wednesday 15 November 2017
Innolux to take up Foxconn 6G LTPS line
Innolux will take up Foxconn Electronics' 6G LTPS LCD fab in Luzhu, southern Taiwan for NT$31.4 billion (US$1.041 billion), a move which will ramp up its global LTPS panel market...
Wednesday 15 November 2017
Nanjing gaining momentum to become semiconductor hub in China
Nanjing is gaining momentum to become a "chip city" in China, as many semiconductor firms have newly announced plans to set up operations in its Jiangbei New Area, including China's...
Wednesday 15 November 2017
TSMC board passes US$4.29 billion budget for capacity expansion
The board of directors of Taiwan Semiconductor Manufacturing Company (TSMC) has approved a budget of about US$4.29 billion mainly to construct new fab facilities and expand production...
Wednesday 15 November 2017
China IC firm sets milestone with rollout of 3D NAND flash
Yangtze River Storage Technology (YMTC) under the Tsinghua Unigroup has successfully developed 32-layer 3D NAND flash chips, marking a new milestone and major technological breakthrough...
Wednesday 15 November 2017
HiSilicon selects Cadence Tensilica Vision P6 DSP for Kirin 970
Cadence Design Systems has announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence Tensilica Vision P6 DSP for its 10nm Kirin 970...