Silicon IP provider M31 has announced the development of its new MIPI M-PHY Gear3 IP on TSMC's 40LP and 28nm HPC+ process nodes. The 40LP M-PHY has been widely adopted by customers...

IC backend houses have recently seen their supply fall short of demand as their delivery times have extended to more than two weeks, up from 4-7 days, according to industry sources...

The government-sponsored Shanghai Industrial Technology Research Institute (SITRI) has its 8-inch wafer fab targeted specifically at the manufacture of MEMS parts with volume production...

The bill of materials (BOM) for an iPhone 7 equipped with 32GB of NAND flash memory carries US$219.80 in bill of materials costs, according to a preliminary estimate from IHS Marki...

Cadence Design Systems has announced the availability of a Cadence Rapid Adoption Kit (RAK) for the new ARM Cortex-R52 CPU, which targets complex embedded designs for safety applications...

Beijing-based GigaDevice Semiconductor has reportedly taken over a Memoright plant located in Wuhan, which could pave the way for the China-based NOR flash vendor to step into the...

Asia-Pacific's grip as the dominant market for IC sales is forecast to strengthen in 2016 with the region expected to account for 61% of the US$282.0 billion IC market, according...

China-based BOE has teamed up at least 100 engineers engaged in R&D for bio-sensors, according to industry sources. A business unit has also been set up under BOE to focus on...

Advanced Semiconductor Engineering (ASE), through its Shanghai-based subsidiary Universal Scientific Industrial (USI), has obtained SiP (system-in-package) backend orders for Wi-Fi,...

IC distributor WPG is expected to post revenue growth of up to 10% sequentially in the third quarter of 2016, a recent Chinese-language Economic Daily News (EDN) report quoted...

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.03 in August 2016, having been above parity for nine months in a row, according to the...

Sprint has introduced the LG X Power, which features the MediaTek Helio P10-series chipset. The device is the first MediaTek-powered smartphone available from Sprint breaking new...

China-based smartphone vendor Oppo, which had its shipments impeded partially by tight supply of flat panels recently, has continued to ramp up its orders for parts and components,...

Worldwide semiconductor manufacturing equipment billings reached US$10.5 billion in the second quarter of 2016, according to SEMI. The billings figure was 26% higher than the prior...

Socionext Inc., an emerging leader in advanced SoC technology for video and imaging systems, today announced the release of SC2M15, a new codec IC designed for video transmission...