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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Wednesday 23 March 2016
IC design house Aspeed to hand out NT$8 in 2015 cash dividend
Server management SoC solution provider Aspeed Technology plans to deal out a cash dividend of NT$8 for 2015, during which the company generated net profits of NT$340 million (US$10.48...
Tuesday 22 March 2016
Fingerprint sensors, facial recognition and biometric surveillance to propel biometrics market to US$30 billion by 2021, says ABI Research
The global biometrics market will reach more than US$30 billion by 2021, marking an impressive 118% increase from 2015, according to ABI Research. Consumer electronics, particularly...
Monday 21 March 2016
TSMC likely to raise 2016 capex
Taiwan Semiconductor Manufacturing Company (TSMC) is likely to revise upward its capex for 2016 as equipment purchases thus far this year have been made in advance, according to industry...
Monday 21 March 2016
Taiwan IC design firms cautious about placing orders for 2Q16
Taiwan-based IC design houses are still reluctant to raise their wafer starts at foundry service providers given that end-market demand except demand from China's handset market remains...
Monday 21 March 2016
Drill bit maker Topoint sees revenues hit bottom in 1Q16
PCB drill bit maker Topoint Technology expects to see its first-quarter revenues hit the lowest quarterly levels for 2016, due to seasonal factors dragging down demand.
Monday 21 March 2016
PCB maker Chin-Poon net profits hit record high in 2015
Chin-Poon Industrial saw its net profits increase 11.8% on year to a record high of NT$1.977 billion (US$61.13 million) in 2015. The earnings translated into an EPS of NT$4.97 for...
Friday 18 March 2016
Japan Display reforms highlight competitive nature of LTPS panel market
The announcement that Japan Display (JDI) is undertaking structural reforms is no surprise considering the competitive state of the LTPS display market for small- to medium-size pa...
Friday 18 March 2016
North American semiconductor equipment industry posts February 2016 book-to-bill ratio of 1.05, says SEMI
North America-based manufacturers of semiconductor equipment posted US$1.26 billion in orders worldwide in February 2016 (three-month average basis) and a book-to-bill ratio of 1.05,...
Friday 18 March 2016
ASE looking to form industrial holding company
Advanced Semiconductor Engineering, which already holds 25% of Siliconware Precision Industries (SPIL), has announced the failure of its tender offer for another 24.71% stake in SPIL...
Friday 18 March 2016
Broadcom rumors say company is looking to phase out Wi-Fi chip business
Broadcom is rumored to be looking to phase out its Wi-Fi chip business in a move to streamline its workforce and product offerings following its acquisition by Avago Technologies,...
Thursday 17 March 2016
Samsung Galaxy S7 teardown reveals ho-hum refresh, says IHS
A preliminary estimate by IHS shows that the Samsung Galaxy S7 smartphone costs about US$255 to build. The US version of the Galaxy S7 with 32GB of NAND memory carries a bill of materials...
Thursday 17 March 2016
ASE fails to gain antitrust approval for SPIL bid
Advanced Semiconductor Engineering (ASE) will be unable to win antitrust approval in Taiwan by March 17 - the deadline of its tender offer for another 24.71% stake in Siliconware...
Thursday 17 March 2016
PC, handset component suppliers worry about mounting inventories
Suppliers in the PC and handset supply chains have begun to worry about piling up inventories of parts and components as current demand for PC and handset products has been falling...
Thursday 17 March 2016
Nine O-S-D product categories avhieve record sales in 2015, says IC Insights
In 2015, nine product categories within the optoelectronics, sensors/actuators, and discretes (O-S-D) marketplace reached record-high sales compared to seven in 2014 and six in 2013,...
Thursday 17 March 2016
Cadence design tools certified for TSMC 7nm design starts and 10nm production
Cadence Design Systems has announced that its digital, signoff and custom/analog tools have achieved V1.0 Design Rule Manual (DRM) and SPICE certification from TSMC for its 10nm FinFET...