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Packaging and testing firms see sales bottom in 1Q12
Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Silicon Precision Industries (SPIL), Powertech Technology (PTI) and Walton Advanced Engineering all expect sales to start growing after hitting bottom in the first quarter.
IN THE NEWS
Friday 16 March 2012
Ardentec sees sales bottom out in 1Q12
IC testing house Ardentec expects sales to start growing after hitting bottom in the first quarter of 2012, as orders, particularly those placed by Europe-based customers, pick up...
Friday 17 February 2012
Walton says 1Q12 revenues to hit bottom
Walton Advanced Engineering expects sales to register sequential growth starting the second quarter after hitting bottom in the first. The memory-IC backend service provider has also...
Thursday 16 February 2012
SPIL chair sees chip market rebound
The global semiconductor market is expected to stage a quick recovery after hitting bottom in the first quarter of 2012, Silicon Precision Industries (SPIL) chairman Bough Lin said...
Monday 13 February 2012
ASE expects sales rebound in 2Q12
Advanced Semiconductor Engineering (ASE) has estimated that its core IC assembly test and material (ATM) business will post another sequential decrease of 6-9% in shipments in the...
Friday 10 February 2012
PTI 1Q12 sales to drop up to 10%, says chairman
Memory packaging and testing specialist Powertech Technology (PTI) now expects its sales to decrease up to 10% sequentially in the first quarter of 2012, company chairman DK Tsai...
Thursday 22 December 2011
LCD market to rebound in 2Q12, says Chipbond
Chipbond Technology has expressed caution about the company's business outlook for the rest of 2011 and first-quarter 2012, as generally weak demand continues to plague the LCD panel...