SEMICON Taiwan 2012 took place in Taipei during September 5-7. A series of technology forums were held with industry heavyweights to share their points of view and opinions on the future of technology.
With semiconductor companies constantly upgrading to the latest advanced technologies, related production materials suppliers are required to raise the technological bar and provide...
With shipments rising gradually for customer products, STMicroelectronics is gearing up to expand its presence in the global MEMS microphone market and is eyeing to become a leading...
SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier...
Micron Technology is striving to establish strategic cooperation with Taiwan-based contract chipmakers, according to company CEO Mark Durcan. Companies such as Taiwan Semiconductor...
Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...
The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...
The integration between Micron Technology and Elpida Memory will be positive for the global DRAM industry in terms of production, technology and client interest, according to Scott...
Taiwan Semiconductor Manufacturing Company (TSMC) is on track in the development of 18-inch (450mm) wafers with the possibility to build a pilot line in 2016-2017 followed by mass...
SEMICON Taiwan 2012 will take place in Taipei during September 5-7. Theme pavilions will include advanced packaging and testing, green manufacturing, MEMS and secondary market.
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