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Trends in industrial computing
Digitimes trackes the latest trends in industrial computing applications, including IoT, Industry 4.0 and automation and robotics.
IN THE NEWS
Wednesday 26 February 2020
Taiwan to see difficulty achieving IoT production goal due to outbreak
Taiwan aims to hike its share of global IoT output value from 3.8% in 2015 to 4.2% in 2020, but the coronavirus outbreak is expected to make it difficult to reach the target, according...
Tuesday 25 February 2020
Taiwan flexible PCB firms aggressive in 5G antenna deployments
Taiwan-based flexible PCB makers including Flexium Interconnect and Career Technology continue to step up their deployments in the 5G antenna board segment with optimism that market...
Tuesday 25 February 2020
Winbond introduces fully compatible drop-in replacement for SPI Flash memory offering comprehensive, end-to-end security for IoT devices
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today extended its innovative family of certified TrustME Secure Flash memory chips by...
Friday 21 February 2020
Sporton to see 2020 revenues grow on testing 5G applications
Mobile device testing and certification service company Sporton International is expected to regain its revenue growth momentum in 2020 from growing 5G applications after experiencing...
Thursday 13 February 2020
Post-coronavirus rebound to take place in 2H20, SEMI believes
The ongoing coronavirus outbreak has had a negative impact on the world's economy and supply chain, but a rebound should take place in the latter half of 2020 thanks to a general...
Tuesday 11 February 2020
Memory chip supply to become tight, says Winbond president
The supply of DRAM and NAND flash memory chips is set to fall short of demand in the second half of 2020, although a pick-up in end-market demand may arrive later than expected, according...
Thursday 6 February 2020
Cobot demand from China to be robust
Factories in China may be avoiding installing collaborative robots at present due to the coronavirus outbreak, but long-term demand will be strong, according to Taiwan-based colaborative...
Thursday 6 February 2020
Outbreak highlights importance of remote management
Traditional industries with plants in China will be most affected by the coronavirus outbreak as they are short of digitalized remote production management capability, according to...
Thursday 30 January 2020
How Foxconn-FCA JV might work in EV market
Foxconn Technology Group's plans to team up with Fiat Chrysler Automobiles (FCA) for the EV industry, which, together with its deployments in digital healthcare and robotics, will...
Wednesday 22 January 2020
Nuvoton joins AWS partner network
Nuvoton Technology has joined the Amazon Web Services (AWS) Partner Network to provide reference designs for IoT devices, according to the Taiwan-based MCU specialist.
Monday 20 January 2020
Huawei revs up cloud, AI as core business
China's telecom equipment giant Huawei has newly upgraded its Cloud & AI business unit as its fourth business group (BG) parallel in status to carrier, enterprise and consumer...
Monday 20 January 2020
Yangtze Memory building memory ecosystem with partners
Yangtze Memory Technology (YMTC) is ramping up its chip output for applications requiring embedded storage and SSD solutions in 2020, and has built partnerships with companies including...
Friday 17 January 2020
Taiwan needs to step up EDA development, says MOST
Taiwan's Ministry of Science and Technology (MOST) is urging the local industry and academy to devote more efforts to R&D on electronic design automation (EDA) to fill Taiwan's...
Thursday 16 January 2020
New Kinpo Group expects over 10% on-year growth in 2020 operation
The New Kinpo Group expects its operation to see a double-digit percentage growth on year in 2020 and many of the group's subsidiaries will be going public beginning this year, according...
Thursday 16 January 2020
IC substrate makers to gain from AiP modules for Apple 5G devices
Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its...