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Trends in industrial computing
Digitimes trackes the latest trends in industrial computing applications, including IoT, Industry 4.0 and automation and robotics.
IN THE NEWS
Thursday 26 December 2019
Taiwan businesses urged to create extra values for clients in 5G, AI era
In the era of 5G and AI, Taiwan businesses must sharpen their capabilities of creating more added-value for clients so as to boost their profiles in the global electronics supply...
Thursday 26 December 2019
Bitmark blokchain system seeks to turn medical data into wealth
Bitmark has created a specialized blockchain application to convert personal medical data - with patients' authorization - into digital assets that can be sold, licensed and transferred...
Thursday 19 December 2019
Netronix to ramp up ePaper solutions shipments for diverse applications in 2020
Netronix, a Taiwan-based provider of ePaper solutions, will ramp up its shipments of new products for education, aviation, logistics, and other IoT applications in 2020, according...
Thursday 19 December 2019
Kinwong, Plotech to build new HDI PCB capacities in China
Chinese PCB maker Kinwong Electronic and Taiwan-based peer Plotech Technology have both disclosed plans to set up new production lines for HDI boards in China seeking to cash in on...
Thursday 19 December 2019
Major robot developers showcasing innovations at iREX 2019
International Robot Exhibition (iREX) 2019 opened in Tokyo, Japan on December 18 with major robot developers including Universal Robots, TM-Robot, OnRobot and Solomon, all showcasing...
Wednesday 18 December 2019
Rigid-flex boards to stay as mainstream for midrange applications
While SiP substrates are increasingly needed to support function upgrades on wearables, TWS earbuds and other devices, rigid-flex PCBs will firmly stay as mainstream applications...
Tuesday 17 December 2019
Highlights of the day: 5G SoC prices likely to drop in 2H20
Although demand for 5G smartphones is expected to pick up dramatically in 2020, prices of related SoC are expected to stay unfriendly for the first half of 2020 and are unlikely to...
Friday 13 December 2019
Hisilicon to sell IoT chip modules on open market, executive says
Hisilicon Technologies, a chip arm of Huawei, will be ready to sell its IoT chip modules on open market in early 2020 at the earliest, according to company technology vice president...
Friday 13 December 2019
Huawei, Xiaomi keen to expand IoT penetration with different approaches
Chinese vendors Huawei and Xiaomi are both keen on developing IoT devices that are promising to replace handsets for smart mobility, video and entertainment applications, and they...
Friday 13 December 2019
Cisco unveils plan for building Internet for next decade
Cisco has unveiled further details behind its technology strategy for building a new Internet - one designed to push digital innovation beyond the performance, economic and power...
Friday 13 December 2019
Advantech sees embedded systems as foundation of IoT platforms
Despite the possibility of only accounting for less than 25% of the AIoT market in the next few years, embedded computing systems will still be crucial for the development of IoT,...
Friday 13 December 2019
IC substrate suppliers see clear order visibility stretch into 2020
Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen their shipments ramp up in most of fourth-quarter 2019 with...
Thursday 12 December 2019
US, Taiwan deepening cooperation in digital economy development
US and Taiwanese firms have been doing well in cooperative development of tech innovations in 5G, IoT and big data analysis, but it requires more efforts from both sides to facilitate...
Monday 9 December 2019
Smart agriculture biotech solutions highlighted at Futex Taipei 2019
Driven by the application of sensors, AI, big data and IoT technologies, smart agriculture has developed rapidly in Taiwan, and a spate of latest smart agricultural solutions unveiled...
Wednesday 4 December 2019
MPI, LCP materials for smartphone antennas to coexist
Modified polyimide (MPI) and liquid crystal polymer (LCP) materials for smartphone antennas are expected to coexist, with the former being adopted mainly for Android models, and the...