The market for rigid-flex PCBs, though smaller than those for other PCB product lines, is gaining expansion momentum as more PCB makers in Taiwan and China are moving to expand their...

Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS)...

With Apple reportedly looking to incorporate mini LED display technology into its iPad and MacBook product lines between second-half 2020 and first-half 2021, Taiwan-based flexible...

Incorporating AI capabilities into terminal edge devices has become an inevitable trend, as intelligent devices are needed to facilitate effective machine-to-machine communication...

Blockchain startup BiiLabs and IoT solutions provider SoftChef have jointly launched Benchy-Alfred SaaS (Software as a Service) platform for machine-to-machine (M2M) encrypted IoT...

NAND flash storage solutions will see much stronger demand in 2020 than 2019 driven by the commercialization of 5G networks and devices, according to Wallace Kou, president and CEO...

Toshiba Memory has announced the launch of a new family of SLC NAND flash memory products for embedded applications. Compatible with the widely-used serial peripheral interface (SPI),...

While AI and 5G technologies will closely complement each other in a variety of applications, edge computing will play the most critical role in the complementarity of both technologies,...

Construction of 5G mmWave base stations has been slow worldwide except in the US due to some major challenges affecting the development of related technologies, but Qualcomm has come...

M31 Technology has announced its series of developments geared to optimize IP solutions for TSMC's specialty processes.

China's Alliance of Industrial Internet (AII) has recently published a white paper about Industrial Internet of Things (IIoT) showing there are currently a few hundred IIoT platforms...

Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...

The Foxconn Group's development direction in the semiconductor industry will primarily focus on vertical integration, aiming to become a solution provider and devoting its investments...

Innolux has teamed up with Taiwan's government-sponsored Industrial Technology Research Institute (ITRI) to develop fan-out panel-level packaging (FOPLP) technology, which will be...

In a report composed jointly by governmental Small and Medium Enterprise Administration, PwC Taiwan and Taiwan Institute of Economic Research noted that about 20% of startups in Taiwan...