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Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.
IN THE NEWS
Thursday 11 September 2025
Taiwan wafer foundry industry, 3Q 2025
Taiwan wafer foundry revenue is estimated to rise mildly in the second half of 2025 from the first half, influenced by US tariff policies and a high revenue base in the first half.
Thursday 11 September 2025
ACM Research courts TSMC as US–China dual-listed chip equipment maker bets on Taiwan expansion
ACM Research (Shanghai), Inc., dual-listed in the US and China, is maneuvering through Washington's escalating curbs on China's chip industry. Chairman David Wang emphasized that...
Thursday 11 September 2025
Taiwan showcases breakthroughs in CoWoS and SiC equipment to boost semiconductor self-reliance
The Industrial Development Administration (IDA) of Taiwan's Ministry of Economic Affairs (MOEA) is partnering with 16 local companies to present heterogeneous integration packaging...
Thursday 11 September 2025
TSMC's presence in Kumamoto exceeds expectations as Kyushu sees over 200 new investment projects
TSMC's Japanese subsidiary JASM has completed and started operations at its first wafer fab in Kumamoto. According to Japanese sources, a second wafer fab is already under construction...
Wednesday 10 September 2025
TSMC's Cliff Hou and Jim Keller rally behind 'Moore's law 2.0' at SEMICON Taiwan

At SEMICON Taiwan's fireside chat, two of the industry's most influential voices pushed back against the idea that Moore's law has run...

Wednesday 10 September 2025
TSMC reports 33.8% revenue increase in August, outlook shaped by AI demand and margin pressures
TSMC posted strong revenue growth in August 2025, recording approximately NT$335.77 billion (approx. US$11.03 billion). The result marks a 3.9% increase from July and a 33.8% rise...
Wednesday 10 September 2025
Exclusive: TSMC turns legacy fabs into EUV pellicle powerhouse, signals new front in chipmaking
TSMC has confirmed it will exit gallium nitride (GaN) foundry operations within two years, shutting down production at its 6-inch Fab 2 in Hsinchu Science Park. The company is also...
Wednesday 10 September 2025
SEMICON Taiwan 2025: Zeiss hits milestone of 10 High NA optic systems shipped as TSMC probes future of Hyper NA EUV
At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the future of extreme ultraviolet (EUV) lithography, outlining its optics roadmap...
Wednesday 10 September 2025
Advanced packaging battle intensifies as foundry, OSAT, and PCB sectors enter tripartite era
Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in...
Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Tuesday 9 September 2025
TSMC and OSATs ramp up advanced semiconductor packaging amid AI-driven demand surge
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...
Tuesday 9 September 2025
TSMC's new materials management VP to debut at 2025 SCM Forum
TSMC will hold its Supply Chain Management Forum (SCM Forum) on November 13, 2025. Notably, Yuan-Guo Huang, who was promoted to vice president of materials management in early August...
Monday 8 September 2025
ASML's rise and Intel's decline retold in new book on lithography battles
Marc Hijink, a technology reporter at Dutch daily NRC, has released "The ASML Way", a book that explores how the Dutch lithography champion rose to dominate semiconductor manufacturing...
Monday 8 September 2025
Samsung weighs new ASML High NA EUV purchases to narrow gap with TSMC in 2nm race
The competition for advanced process leadership among TSMC, Samsung Electronics, and Intel is intensifying, making the pace of their new equipment acquisitions a key industry focus...
Monday 8 September 2025
Skytech secures orders for self-developed PLP equipment as OSAT firms adopt CoPoS
Following TSMC's confirmation in February 2025 that it will include 310×310 mm panels in its chip-on-panel-on-substrate (CoPoS) mass production, supply chain players—including...