The newly appointed chairman of Taiwan Semiconductor Manufacturing Company (TSMC) C.C. Wei has revealed five strategic priorities in his first week of the new position.

Nvidia CEO Jensen Huang attended Computex 2024 in Taipei last week, sparking an AI frenzy in Taiwan.

Benefiting from the expanded orders from AI and High-Performance Computing (HPC) customers, TSMC's May 2024 revenue remained high at NT$229.62 billion (US$7 billion), a slight decrease...

In a strategic move to bolster AI semiconductor competitiveness, SK Group Chairman Chey Tae-won and SK Hynix President Kwak Noh-Jun made a whirlwind visit to Taiwan on June 6.

Intel CEO Pat Gelsinger's keynote at COMPUTEX 2024, specifically mentioned the collaboration with TSMC, which allowed Intel to realize the mass production of Lunar Lake in advancing...

Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something...

Jefferies analysts revealed that ASML is expected to ship its high-NA EUV system to TSMC and expected the chipmaker to use the expensive machine in high-volume chip manufacturing...

Vanguard International Semiconductor (VIS) has reached an agreement with NXP Semiconductors to establish a 12-inch joint venture fab in Singapore, and the development of the JV fab...

The CEOs of major US chip makers attended this year's Computex and all lauded Taiwan's industry supply chain led by TSMC.

On June 4, TSMC hosted its annual shareholder meeting, during which the pure-play foundry re-elected its board of directors. In answer to a query at today's meeting regarding whether...

This year's Computex is mostly centered on AI-enabled servers and PCs. However, while the opportunities for AI server firms are limitless, the outlook for AI PCs must be carefully...

AMD has released its roadmap for forthcoming AI accelerators until 2026, which includes the MI350, which will be manufactured utilizing TSMC's 3nm process technology.

AMD has a close and solid relationship with TSMC on the 3nm technology, and the two companies are already working on several new product developments, according to Lisa Su, chairperson...

The competition for advanced process orders between Samsung Electronics and TSMC has long been a point of attention in the industry.

Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...