Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...
It remains uncertain how the outcome of the US presidential election may change the country's trade tensions with China, but semiconductor firms in Taiwan generally believe the American...
With 8-inch wafer fabrication demand rising rapidly for chips including ultra-thin fingerprint sensors, power management ICs, MOSFET chips and display driver ICs, second-tier foundries...
IC testing solution provider Chunghwa Precision Test Tech (CHPT) and 3D sensor components packager Xintec have posted impressive revenue gains for the first three quarters of 2020...
TSMC has seen capacity utilization rates for 28nm process technology surge and come to nearly 100% in the fourth quarter of 2020, thanks to the bulk of orders transferred by Qualcomm...
Less than one year after Mellanox was acquired by Nvidia for US$7 billion, Alon Webman, co-founder of Mellanox, started his second entrepreneurial project. The new company, Chain...
Taiwan-based Phoenix Silicon International (PSI) and Kinik, providers of silicon wafer reclaim services, have both obtained orders from TSMC for 5nm and more advanced process manufacturing,...
IC design house FocalTech Systems continues to enjoy robust demand for its TDDI (touch with display driver integration) chip solutions, with shipments set to hike over 100% to 220-230...
Samsung Electronics is reportedly looking to advance its partnership with EUV fab tool vendor ASML, aiming to accelerate the development of its advanced 5nm and 3nm foundry process...
TSMC is fast advancing its IC packaging technology in line with its efforts to extend the relevance of Moore's Law. The foundry's 6th-generation CoWoS...
Fabless chipmakers, component suppliers and IC distributors have been aggressively scaling up their inventory levels, raising concerns of the semiconductor market having to undergo...
TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...
Intel has agreed to sell its NAND flash and storage business to SK Hynix, but the chipmaker is also facing increasingly intense competition from AMD, Nvidia and even Apple in its...
Sentelic, which specializes in fan motor controller ICs for servers, will be listed on the Taiwan over-the-counter (OTC) stock market in mid- or late-November.
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