Semiconductor Manufacturing International (SMIC) has moved 14nm FinFET process to volume production with orders from Huawei's chip arm HiSilicon, and is gearing up for its next-generation...
TSMC has furthered tightened precautionary measures internally against the coronavirus, which has so far not affected its operations in Taiwan, according to the pure-play foundry.
Backend and verification demand for ASICs, AI chips and HPC (high performance computing) chips from segments of 5G base stations, servers and datacenters has remained strong despite...
Taiwan-based chipmakers are gearing up to fulfill robust orders for ASIC services from clients in China and even from the world's first-tier brand vendors that are seeking to enhance...
In the wake of the coronavirus outbreak, many firms in the IT world have revised their business outlook for first-quarter 2020. But TSMC still sees significant demand for its foundry...
IC backend and verification specialists in the supply chain of Apple devices have regained confidence in their revenue performances for 2020 as they are moving to deliver shipments...
Gudeng Precision Industrial has enjoyed robust demand for EUV mask pods, and plans to implement its capacity expansion project ahead of schedule, according to the Taiwan-based fab...
While the Southern Taiwan Science Park (STSP) saw its total revenues decline 6.59% to NT$743.236 billion (US$24.6 billion) in 2019, Taiwan Semiconductor Manufacturing Company (TSMC)...
TSMC is set to kick off volume production of chips built using 5nm process technology in April, and has already seen the process capacity fully booked by clients, according to industry...
Shipments from the 5G handset supply chain for the first half of 2020 are expected to be one third of those for the second half, instead of 50% as estimated earlier, as first-quarter...
TSMC is unqestionably the global leader in the pure-play foundry, but it is also gearing up efforts expanding its presence in the backend sector. Its advanced wafer-level...
Pure-play foundry TSMC has been expanding its presence in the advanced wafer-level packaging field, and is set to enjoy rising utilization of its backend capacity starting the second...
