Taiwan Semiconductor Manufacturing Company (TSMC) has reported consolidated revenues for March 2018 of about NT$103.7 billion (US$3.55 billion), up 60.4% sequentially and 20.8% on...
Apple is gearing up efforts developing micro LED panels for both small-size and large-size applications and has received support from Taiwan Semiconductor Manufacturing Company (TSMC)...
The InFO WLP (integrated fan-out wafer level packaging) and CoWoS (chip on wafer on substrate) developed by Taiwan Semiconductor Manufacturing Company (TSMC) have emerged as two major...
Strong demand for Internet of Things (IoT) related chips is filling China- and Taiwan-based pure-play foundries' 8-inch fab capacities, according to industry sources.
With more device vendors developing their chip solutions in-house, as well as China pushing for self-sufficiency in semiconductors, demand for custom ASIC chips has been growing substantially,...
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to see its March revenues rebound to over NT$100 billion (US$3.43 billion), driven by a ramp-up of 16nm and 12nm chip...
Taiwan-based Ardentec is expected to enjoy growing revenues generated from orders for automotive MCUs in 2018, according to industry sources. The IC testing company has seen orders...
Major IC packaging and testing players are actively developing an advanced fan-out panel level packaging (FOPLP) technology that can package chips on panels larger than 8-inch or...
Taiwan-based cleanroom maker United Information Systems (UIS) has enjoyed strong orders placed by its panel and semiconductor clients since 2018, and expects its revenues this year...
China's dedicated mining ASIC supplier Bitmain has squeezed into the list of the nation's startup unicorns, and its quarter-by-quarter shipment growth of mining ASICs as well as its...
Taiwan and international IC designers have advanced fabrication orders with foundry houses to early 2018 to support shipments in the traditional boom season in the second half, amid...
Xilinx has introduced a new product category called adaptive compute acceleration platform (ACAP) - a highly integrated multi-core heterogeneous compute platform - for big data and...
Bolstered by China's large population, solid mobile network infrastructures, and aggressive deployments in IoT and AI applications, the localization of its semiconductor industry...
TSMC's 16nm and 12nm process production capacity has been tight in the first quarter of 2018 driven by strong demand for GPUs and ASICs for cryptocurrency mining, according to industry...
206/319 pages
Members only
Sorry, the page you are trying to open is available only for our paid subscribers.