Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...

IC testing solution provider Chunghwa Precision Test Technology (CHPT) has reported consolidated revenues of NT$278 million (US$9.2 million) for May 2017, hitting a monthly record...

Taiwan-based pure-play foundries Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have reported sequential...

Taiwan Semiconductor Manufacturing Company (TSMC) has reiterated its 5nm chip production will take place at its manufacturing site at the South Taiwan Science Park (STSP), although...

Taiwan Semiconductor Manufacturing Company has announced the promotion of a veteran executive, Dave Keller to president of TSMC North America. Rick Cassidy remains as CEO of TSMC...

More patrons other than IC-design houses and IDMs are likely to flock to wafer foundry houses looking for advanced capacity for emerging applications such IoT, Big Data, self-driving...

Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) on June 5 disclosed a total of about NT$3.09 billion (US$102.8 million) spent on machinery equipment from ASML,...

Taiwan Semiconductor Manufacturing Company (TSMC) will further enhance its competiveness by stepping into production of next generation memory chips in addition to current mainstream...

MediaTek is expected to start mass production of 12nm mobile chips manufactured by Taiwan Semiconductor Manufacturing Company around the end of 2017, according to industry sources...

Taiwan Semiconductor Manufacturing Company's (TSMC) new 12-inch plant in Nanjing, China will be ready for equipment move-in in September 2017, according to the Taiwan-based foundry...

IC materials distributor Topco Scientific is expected to post more than 10% revenue growth in 2017 driven by robust demand for silicon wafers and photoresist solutions, according...

It is not a tip but true that the new iPhone devices scheduled to be rolled out in the second half of 2017 will come without a home button, according to a Chinese-language Economic...

Taiwan Semiconductor Manufacturing Company (TSMC) is set to move its 7nm process technology to volume production in 2018, an improved version of the 7nm process using extreme ultraviolet...

Advanced Semiconductor Engineering (ASE) has reportedly secured orders for providing fan-out wafer-level packaging (FOWLP) service for Infineon Technologies' power management (PWM)...

Huawei will begin volume shipments of its NB-IoT (NarrowBand IoT) chip, the Boudica 120, in June, according to Jiang Wancheng, vice president of marketing and solutions department...