Cadence Design Systems has announced that its digital and custom/analog tools have achieved certification from TSMC for its most-current version of 10nm FinFET Design Rule Manual...
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for the fifth phase construction of its 12-inch wafer plant in central Taiwan in May, according to industry sour...
Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...
China-based NewEdge Technology has started shipping its wireless charging ICs in volume. The chips are being manufacturing using TSMC's 0.18-micron technology, according to industry...
Qualcomm's next-generation application processor (AP), the Snapdragon 820, is expected to outsource to Samsung Electronics using a 14nm node, which the Korea-based foundry house has...
M31 Technology has announced the availability of its low-voltage and low-power physical IP solutions on TSMC 55nm ultra-low power process technology. The platform provides system-on-a-chip...
United Microelectronics (UMC) has obtained some orders for high-end 28nm chips from Taiwan Semiconductor Manufacturing Company's (TSMC) major clients including Qualcomm and MediaTek,...
Qualcomm and MediaTek have both shifted some of their 28nm chip orders from Taiwan Semiconductor Manufacturing Company (TSMC) to other foundry chipmakers that offer cheaper quotes,...
Taiwan Semiconductor Manufacturing Company (TSMC) will remain the major processor supplier for Apple in the second half of 2015 as the foundry will supply 20nm chips for an upcoming...
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to post revenue growth of 0-5% sequentially in the second quarter of 2015, buoyed mainly by rising output for 20nm chips,...
Qualcomm, which is believed to have lost processor orders for the Galaxy S6 series smartphones from Samsung Electronics, is vying for orders for the upcoming Galaxy Note 5, according...
Taiwan-based chipmakers including foundries Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC), memory maker Inotera Memories, and IC packaging house...
Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...
Image sensor packaging house Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC), will list on Taiwan's over-the-counter (OTC) stock market at the end of March...
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