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19 Mar 2008

Samsung Electronics CEO busy with overseas trips (Mar 19)

US airwaves bids total US$19.6 billion as auction ends (Mar 18)

Taiwanese firms facing high tax for US R&D operations (Mar 19)

US market: The RV530 of Toshiba's REGZA LCD TV series (Mar 18)

Japanese electronics makers shrink screens (Mar 17)

Sharp hikes LCD-making efficiency (Mar 19)

LED Projection Report (Mar 18)

LED company aims to improve TVs, gets US$72 million (Mar 17)

Study a technology forecast for low-cost projectors including what changes in the technology can be expected through 2010 (Mar 18)

Report Increases Worries Of A Semiconductor Glut (Mar 18)

Microsoft, Intel research parallel computing with US universities (Mar 18)

Intel to Shrink Upcoming Nehalem Chips for Laptops (Mar 17)

Avago announces miniature signal conditioning IC for optical sensors (Mar 19)

Embedding future growth - Q&A with Freescale on embedded technology (Mar 18)

Lexar Media announces new DDR3-2000MHz memory for gamers (Mar 18)

Under the Hood: The next gold rush: solar power (Mar 10)

Intel, Samsung comment on flash, SSD reliability (Mar 18)

Dell CEO: Windows Vista to boost chip demand (Mar 18)

Etron upbeat on DRAM mkt in 08 (Mar 18)

18 Mar 2008

Will HDTV screens get smaller? (Mar 18)

Analyse price forecasts for LCD-TV BLUs as a function of size through 2010 with this latest report (Mar 18)

Taiwanese display industry trends (02/2008) (Mar 18)

Korean industry display trends (02/2008) (Mar 18)

Vistec exhibits electron beam lithography system at Semicon China (Mar 18)

From BFS to ZFS: past, present, and future of file systems (Mar 16)

Microsoft, in Supreme Court appeal, fails to stop Novell suit (Mar 17)

Sony plans $100M investment in Indianapolis plant (Mar 17)

Apple patent would allow iPhone clamshell (Mar 17)

Cirrus Logic to shut down China IC design unit (Mar 18)

Solargiga IPO announced (Mar 17)

EU nations to push DVB-H over other mobile TV standards (Mar 17)

Microsoft eyes iPhone with Adobe Flash smartphone deal (Mar 17)

India's Tata, BP Solar get US$78mn more for solar venture (Mar 17)

Elpida and MEARS sign agreement to leverage MEARS silicon technology (Mar 17)

"...By enhancing the physical properties of silicon through a breakthrough in materials engineering, MEARS has demonstrated that MEARS Technologies' MST for CMOS will improve overall chip performance and reduce static power without introducing any new materials into existing manufacturing process flows..."

IBM researchers develop world's tiniest nanophotonic switch to route optical data between cores in future computer chips (Mar 17)

Toshiba gets flash-ier: Will ship notebook with 128GB SSD (Mar 17)

Samsung and Toshiba new leaders in greener electronics ranking (Mar 18)

Corsair introduces memory module for MAC (Mar 13)

Silicon Labs enhances RDS data receivers for portable and in-car navigation devices (Mar 17)

LG Chem and Universal Display announce collaboration to accelerate development of OLED materials (Mar 18)

677/1505 pages

Realtime news

Exclusive: Asus seizes OLED crown from Samsung, VP breaks silence
The global OLED display market is fiercely competitive, becoming a key battleground for major brands...

Nvidia at APEC Summit 2025
APEC Summit 2025 takes place from October 31 to November 1 in South Korea. Amidst intensifying geopolitical and trade tensions, the event featured many...

Special reports

NTN convergence

DIGITIMES believes that non-terrestrial networks (NTN) will serve as a foundational pillar in the transition toward 6G, integrating...

FOPLP tech development

The AI chip market holds tremendous potential - breakthroughs in FOPLP technology to overcome the RDL-first process barrier...

Tech and deployment of China top-3 PSU players

The three major Chinese power supply manufacturers leverage local industry advantages and technologies, actively moving toward...

Veeam Q4 Platform Content Syn

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