AI is transforming the way we live and work, and for companies like Aira, the real challenge is to turn AI applications into practical solutions that can be implemented at scale. Aira, a provider of AI-based facial biometrics platforms with deep-rooted expertise in AI, IoT, and computer vision, aims to "bring AI to life." The company has leveraged the compact yet powerful for vertical markets such as live sports and entertainment, manufacturing, and retail.Founded in 2020, Aira's core team hails from automation and tech industries, bringing a wealth of experience in AI and related technologies. Aira's unique advantage lies in efficiently running AI algorithms on low-power CPUs, and handling complex tasks without needing a GPU. Currently, Aira provides smart AI solutions to clients in Taiwan, Japan, Southeast Asia, the U.S., and Australia, demonstrating strong potential for global expansion.Compared to the common practice of running AI algorithms on GPUs, aAira has optimized the Intel® processors within the ASUS NUC to drive their solutions. This approach not only reduces costs but also offers significant advantages, including easier accessibility, lower power consumption, compact size, and faster integration. This allows Aira to deploy its AI-tracking solutions across various field operations, where space restriction is a major concern.Li emphasizes that, unlike many AI solutions still in the proof-of-concept stage, Aira delivers AI solutions ready for immediate local implementation. The ASUS NUC, with its Intel Core™ i7 and i9 processors, offers robust computational power, with a single unit being able to handle real-time AI analysis of data from 20 to 50 cameras, enhancing the scalability and suitability of Aira's solutions across large-scale deployments. Furthermore, the stability of the ASUS NUC makes it ideal for 24/7 AI operations over extended periods of time Aira's installations have been running continuously for three years. In addition, the design of ASUS NUC allows it to dusty environments, making it ideal for deployments in factories or outdoor environments.Leveraging ASUS NUC, Aira has introduced a suite of AI solutions tailored to various industries. For instance, in construction sites, the Aira safety monitoring system can automatically detect whether workers are wearing proper protective equipment, significantly improving on-site safety and reducing the need for manual inspections. In retail, Aira's customer flow analysis system tracks foot traffic and duration of visits, and even recognizes repeat customers. This gives retailers precise, and comprehensive data to formulate effective business strategies.With ASUS NUC, Aira has successfully combined efficient AI computation with streamlined deployment, saving costs and energy. Li notes that Aira plans to continue capitalizing on the computational power, compact size, high stability, and global availability of the ASUS NUC to provide its AI solutions to businesses worldwide.For more product information, please refer to the ASUS NUC website.

SK Hynix Inc. announced today that the key features of its Heterogeneous Memory Software Development Kit (HMSDK)1 are now available on Linux2, the world's largest open-source operating system.1Heterogeneous Memory Software Development Kit (HMSDK): SK Hynix's proprietary software development kit. It enables effective memory control, improving the performance of heterogeneous memory systems such as CXL memory.2Linux: An operating system developed in 1991 by Linus Torvalds that has since expanded to become the world's largest open-source operating system. Most operating systems for cloud systems and supercomputers, as well as smartphones, cars, and appliances, are built on Linux.HMSDK is SK Hynix's proprietary software for optimizing the operation of Compute Express Link (CXL)3, which is gaining attention as a next-generation AI memory technology along with High Bandwidth Memory (HBM). Having received global recognition for HMSDK's performance, SK Hynix is now integrating it with Linux. This accomplishment marks a significant milestone for the company as it highlights the company's competitiveness in software, adding to the recognition for its high-performance memory hardware such as HBM.3Compute Express Link (CXL): A next-generation interface that efficiently connects CPU, GPU, memory, and other components in high-performance computing systems to support massive, ultra-fast computation. By applying CXL to existing memory modules, the capacity can be expanded by more than 10 times.In the future, developers around the world working on Linux will be able to use SK Hynix's technology as the industry standard for CXL memory, putting the company in an advantageous position for global collaboration on next-generation memory.SK Hynix's HMSDK enhances memory package's bandwidth by over 30% without modifying existing applications. It achieves this by selectively allocating memory based on the bandwidth between existing memory and expanded CXL memory. Additionally, the software improves performance by more than 12% over conventional systems through optimization based on access frequency, a feature which relocates frequently accessed data to faster memory.The semiconductor industry anticipates full commercialization of CXL in the second half of 2024, coinciding with the release of the first server CPUs featuring the "CXL 2.0" specification. In preparation for this, SK Hynix is currently validating CXL 2.0 memory in 96 GB and 128 GB capacities with customers. The company plans to begin mass production by the end of the year."For the development and spread of AI systems such as large language models (LLMs), it is now necessary to significantly improve not only semiconductors but also the level of system applications to support them," said Youngpyo Joo, Head of Software Solution at SK Hynix. "With this Linux integration and collaboration, we will strive to improve our status as a total AI memory solutions provider by innovating technologies and expanding the ecosystem in this field."About SK Hynix Inc.SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), flash memory chips ("NAND flash"), and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

With the rapid changes in global climate, environmental issues have garnered significant attention. Additionally, the demand for green energy solutions has increased across various industries. However, the market still faces numerous challenges, ranging from inefficient energy conversion to the complex integration of systems and the lack of comprehensive solutions.MEAN WELL, a leading brand in standard power supply solutions, is actively advancing the innovative development of new energy technologies through its robust technological foundation and forward-thinking strategic approach. Tony Hsieh, Section Manager of MEAN WELL's Technical Service Center, stated that the company recently showcased its latest technologies and products at the C3 Green Technology Hall, available through MEAN WELL's Online Expo. This hall integrates the resources of MEAN WELL and the SDG Group, focusing on four key Green Energy, Energy Conservation, Energy Storage, and Intelligent Energy, providing customers with comprehensive, one-stop solutions.NTN-5K series: An Inverter Solution for Energy Storage & Backup Uninterruptible Power SystemHsieh pointed out that MEAN WELL has launched a number of innovative green energy products. For instance, the NTN-5K Off-Grid Industrial Grade 2-in-1 Charging Inverter employs bidirectional energy conversion technology, which reduces system size and enhances the price/performance ratio. It can also be integrated with solar panels and energy storage systems, significantly boosting energy efficiency. Another key product, the SHP-30K series of Ultra High Wattage & High-efficiency Power Supplies, is primarily designed for applications in emerging fields such as hydrogen electrolysis, industrial lasers, and solid-state amplifiers, demonstrating MEAN WELL's lead in pioneering technological applications.MEAN WELL's green energy product line features advanced bifacial solar modules, delivering up to 715 W of front-side power, with an efficiency of up to 23% and a bifaciality factor of up to 85%. These high-efficiency modules are backed by a 30-year power quality guarantee and exhibit outstanding anti-LeTID and anti-PID performance, significantly enhancing their reliability and durability. To further optimize solar system efficiency, MEAN WELL's partners are continuously advancing maximum power point tracking (MPPT) technology, integrating it into their solar charge/discharge controllers. This allows for real-time tracking of the highest voltage and current values from solar modules, thereby maximizing power output.MEAN WELL offers a comprehensive range of solutions for energy conservation. The company's centralized power supply systems enhance energy utilization and reliability through centralized energy management, thereby minimizing energy loss and reducing environmental pollution. Additionally, MEAN WELL's energy recovery equipment enables the transfer of excess electricity from production or testing processes back into the power grid, which effectively lowers carbon dioxide emissions and results in significant energy cost savings for companies. For instance, the company's VFD drives leverage the efficiency and compactness of brushless DC motors to substantially boost factory energy-saving performance. Moreover, MEAN WELL has introduced the TPA series of power controllers, which employ 32-bit high-speed DSPs to offer high precision and stability while supporting various control modes tailored to different applications.In the field of energy storage, MEAN WELL has developed a complete range of energy storage products suitable for residential, mobile, and commercial applications. Residential energy storage systems can not only help users to effectively balance the load on the power grid but also address peak demand requirements, thereby significantly enhancing energy utilization. MEAN WELL's mobile energy storage solutions, with power capacities ranging from 300 to 3000 watts, are ideal for outdoor activities, fieldwork, emergency roadside assistance, and various other scenarios, providing reliable and convenient energy supply. Additionally, MEAN WELL's home energy storage solutions leverage renewable energy and advanced storage technologies to effectively balance electricity supply and demand, thereby improving energy efficiency and reducing costs.Hsieh mentioned that MEAN WELL's product strategy revolves around the concept of "4S + 3 Highs." "4S" stands for systems, software, solutions, and service, while the "3 Highs" refer to high production efficiency, high added value, and high price/performance ratio. This strategy is also reflected in the design of MEAN WELL's products in the areas of green energy, energy conservation, and energy storage. By enhancing the quality of its hardware products and integrating software and safety verification services, MEAN WELL delivers comprehensive and effective system solutions to the customers.To further enhance service quality, MEAN WELL not only develops software and hardware products but also leverages the resources of its affiliated companies, such as PowerNex Precision Technology and SHARE WELL (including SHARE WELL Green Power Technology and SHARE WELL Certification), to offer integrated, one-stop services. For instance, Hsieh mentioned that the NTN-5K Off-Grid Industrial Grade 2-in-1 Charging Inverter can be seamlessly combined with solar panels and MPPT charge controllers from MEAN WELL's partners, creating highly efficient and stable solutions. This integration simplifies the procurement process for customers, ensures compatibility and stability of all system components, and improves overall performance and reliability.In addition, MEAN WELL has set up product consultation sections in the C3 Green Technology Hall and the C4 Product & Technical Service Center to quickly answer users' questions and help customers to build systems that meet their needs. In this way, customers can communicate directly with MEAN WELL's professional team to customize solutions. Moreover, MEAN WELL provides comprehensive after-sales services and technical support to ensure that the performance of its products is fully utilized to maximize energy efficiency.Hsieh concluded that, with advancements in green energy, energy conservation, and energy storage technologies, MEAN WELL will persist in its investment in research and development. The company will enhance its "4S + 3 Highs" strategy and bolster the integration of software and hardware. MEAN WELL is committed to delivering smarter and more efficient energy solutions to its customers and strengthening collaboration within its corporate group. The company aims to broaden the scope of its comprehensive services and contribute significantly to energy transformation and industry development, as articulated by Hsieh.

LitePoint, a leading provider of wireless testing solutions, hosted "Future First, Smart Testing" innovative testing technology seminars in Taipei and Hsinchu on July 23rd and August 8th, 2024. This year's focus revolves around testing and validation of various wireless communication technologies, spanning from the deepening of 5G technology to the commercial progress of 5G-Advanced (5G-A) technology, as well as the mass production of Wi-Fi 7 in the latter half of 2024. Additionally, it encompasses the emergence of innovative technologies and smart applications in Bluetooth and Ultra-Wideband (UWB) technologies, showcasing the thriving influence and boundless potential of wireless communication technologies.Elvin Ren, General Manager of APAC Sales, took the stage first to deliver an opening speech. Besides welcoming the esteemed guests present, he succinctly introduced the current dynamic developments in LitePoint's testing technologies, offering easy-to-use products and simplified testing processes that continuously drive the future of highly reliable, low-latency smart applications. Seeing the growth trends in the APAC region, LitePoint has swiftly established a service center in Vietnam and a repair center in India, reinforcing its product layout and technical support capabilities in the APAC region to assist customers in grasping diverse wireless communication testing technologies and seizing valuable market opportunities.Frank Chang, General Manager of ACE Solution, subsequently introduced automotive applications. He addressed smart automotive applications and developments leveraging AI, validating automotive smart applications through chip and wireless communication testing. These include various smart applications such as ADAS, automotive radar, electronic power drive, and V2X, along with the introduction of LitePoint's full range of testing solution systems.Frank Chang, General Manager of ACE SolutionThe progress of multiple wireless communication technologies in the AI eraYuka Muto, Senior Product Manager at LitePoint, echoed the future development of diversified testing technologies for wireless testing in the AI era during her keynote speech. Comparing her first visit to Taiwan in 2000 to her current business trip, she felt the wonderful use cases initiated by wireless communication technology, creating an unparalleled and comfortable business travel experience. The rise of AI technology symbolizes the takeoff of a new era.While AI technology is dazzling, it requires massive data to train the accuracy of AI models, necessitating various wireless communication technologies to collect and connect data, providing extensive bandwidth, high-stability network connections, and low-latency data transmission capabilities. This includes the integration of technologies such as 5G, Wi-Fi, Bluetooth, UWB, and NTN, coupled with information security technologies, to create AI applications that satisfy the diverse needs of end-users. However, validating and testing these technologies require LitePoint's testing solutions to ensure data integrity, allowing AI to continuously create astonishing user experiences.Yuka Muto, senior product manager at LitePointInsights from the 2024 MWC Shanghai on the new changes in 5G-advancedBenson Wu, Senior Analyst and Research Manager at DIGITIMES, highlighted the new developments and trends of 5G-Advanced (5G-A) at the 2024 MWC Shanghai. Drawing from his on-site experience with China's three major telecom operators promoting 5G-A services, he looked forward to China surpassing the milestone of one billion users in 2024. Unfortunately, the financial outcomes of this transition are not solid, making enhancing the profitability of 5G networks a perpetual pursuit for global telecom operators. This involves the introduction of new 5G killer applications, with AI's multiplier effect becoming a significant driving force. He quoted a new formula from the event: "Compute Power x Connect AIx = Future," representing the breathtaking anticipation for thriving AI applications. He enumerated current mainstream highlights, including low-altitude drones (eVToL), AI language large models (LLM), Gen AI dialect translation applications, 5G new calls, and 5G NoVR calls, along with various mobile phone products and NTN satellite communication services. These signify the precious value of creating differentiated services and the irresistible new economic model of 5G-A.Benson Wu, senior analyst and research manager at DIGITIMESValidating wi-fi 7 RF performance with the IQxel-MX seriesYoung Huang, Team lead of applications, explored the validation of Wi-Fi 7 technology in RF performance. He focused on the real-world performance and market acceptance of Wi-Fi 7 systems, where RF performance is a crucial aspect for direct competition. He pointed out key viewpoints such as UL-OFDMA technology, transmission range, and transmission rate, along with validating the actual benefits of Wi-Fi 7 coexisting with other wireless communication technologies. Since Wi-Fi 7 requires the use of the 6GHz spectrum band to achieve optimal benefits of 320MB bandwidth and 4096 QAM modulation, validation of test strategies under different transmit power settings is necessary due to frequency interference in the 6GHz spectrum band, involving AFC-defined functions and actual simulation of the test environment.Furthermore, in system performance testing, involving range and rate testing validation, examining transmission latency, range, and rate verification is crucial. By using IQsniffer products as intermediate monitoring tools, besides analyzing the PHY and MAC layer performance of the RF transmitter, it also measures Wi-Fi and BT signal interference, analyzing results above the MAC layer. These are important challenges faced in the design of Wi-Fi 7 systems, echoing the importance of LitePoint's testing machine capabilities. Responding to the new technical challenges of Wi-Fi 7, LitePoint deploys the IQxel series, led by the IQxel-MX series, with IQfact+ automated testing software to satisfy complete RF performance testing needs.Young Huang, team lead of applicationsThe importance of seamless testing for 5G O-RAN radio unitsBrady Chen, Senior Application Engineer, focused his presentation on the testing process and solutions for O-RAN Radio Units (RU). To address the needs of different field infrastructure scenarios, the diversification of O-RAN equipment becomes a key consideration for telecom operators in optimizing networks, information transmission throughput, and costs. The expected performance of O-RAN RU functions requires complete testing to ensure, for which LitePoint provides effective solutions to assist supply chain manufacturers in facing different testing needs.He focused on O-RAN Fronthaul Conformance Test consistency testing, mainly through Fronthaul to test the test items and parameters specified by the O-RAN.WG4.CONF standard, covering M-Plane, S-Plane, and UC-Plane function testing. Therefore, LitePoint provides testing solutions to assist in the convenient testing of RU products, with the IQFR1-RU full-function testing machine as the main solution, providing complete 3GPP 5G NR RF downlink/uplink testing, MIMO testing, and Interference testing scenarios. Since test items and scenarios require considerable testing equipment setup and installation time, LitePoint provides software integration tools like IQfact5G to solve production line setup processes, saving significant time on calibration, installation, and parameter settings, and accelerating and streamlining processes with parallel processing, greatly reducing RU testing time. Additionally, RU Tx and Rx testing can be integrated into a single machine, helping RU suppliers and telecom operators accelerate the commercialization process.Brady Chen, senior application engineerExploring Bluetooth next-generation features, wireless testing needs, and technologiesJoe Chang, Application Engineer at LitePoint, analyzed the testing of the new generation Bluetooth Channel Sounding positioning function, focusing on physical layer testing. Bluetooth technology is no longer limited to 2.4GHz spectrum transmission; it has now expanded to use the 5GHz and 6GHz frequency bands, switching frequency transmission to complete anti-interference design requirements. In 2024, it is estimated that there will be over 250 million Bluetooth devices, making the channel-sounding positioning function a valuable market opportunity. Regarding testing details, it emphasizes different testing technologies and needs, including RSSI and Time of Flight (ToF).The Channel Sounding positioning function originates from important ranging technologies such as PBR (Phase Based Ranging) and ToF (Time of Flight). Testing challenges require validating multiple scenarios and technical challenges. To facilitate testing of different usage scenarios where Bluetooth devices are mixed with various electronic devices, LitePoint introduces the IQxel-MW 7G and IQxel-MX to address the needs of different testing scenarios for BT Channel Sounding positioning, assisting customers in creating next-generation Bluetooth device products and capturing important business opportunities.Joe Chang, application engineer at LitePointUnlocking the full potential of 5G: 5G advanced technology leading new applicationsSenior Product Manager Middle Wen presented on the current trending topic of 5G Advanced technology. He began by noting that about half of the lifecycle of the 5G era has passed since its inception. The use of a true 5G Standalone (SA) standard network will dominate the future of subsequent 5G applications, marking the birth of the 5G-A era. The related functions and specifications will be defined by the 3GPP's R17, R18, and R19 standards. Looking at the new features of 5G-A from the perspective of the 3GPP R17 standard, he listed several, including the Sidelink standard, which focuses on direct connections between devices, followed by the RedCap standard and the significant development of NTN technology for satellite communications. Other features include Network Slicing technology specifications, the introduction of AI/ML to enhance network connection efficiency, and further evolution of power-saving functions in 5G networks. The use of additional spectrum and the transition to the next-generation 6G network will be completed with the subsequent release of 3GPP standards.Furthermore, regarding the highly regarded RedCap standard, the R17 version is tailored to the needs of wearable devices, industrial sensors, and security surveillance cameras. The R18 RedCap standard actively discusses replacing traditional IoT device connection methods. Additionally, NTN networks represent another groundbreaking change, defining IoT-NTN and NR-NTN architectures. Traditional satellites, which only performed direct signal transmission, have evolved into new-type satellites with base station functionality, completing the definition of regenerative satellites. In the future, mobile phones will be able to directly connect to satellites for data transmission. The 3GPP plans to standardize satellite communications and create examples of seamless mobile phone and satellite connections. Promising applications in the 5G-A era include AR/VR, industrial 5G private networks, IoT connections under RedCap, autonomous vehicle systems, and a wide range of smart applications composed of LBS technology.Regarding LitePoint's testing solution product strategy, it involves supporting the FR1, FR2, and FR3 spectrums, including the expansion and development of signaling and non-signaling machines. The product strategy for automated testing software will be customized and differentiated for chipset and module manufacturers. Other testing tools are convenient and practical, advocating a plug-and-play usage approach. As 5G-A technology undergoes significant modifications to welcome the SA network architecture, more changes to the 5G SA network will soon captivate consumers' attention.Middle Wen, senior product managerExploring the rapidly developing ultra-wideband (UWB) technology: a rising starChih-Wei Huang, Team lead of applications, delivered the presentation focusing on the currently popular UWB micro-positioning technology applications and testing solutions. UWB precise positioning technology, which can achieve accuracy within 10 centimeters, is highly popular in flagship smartphones. It is utilized in various applications such as indoor navigation, smart homes, and various automotive smart keys (Digital Key), showcasing a promising development outlook and extensive extended application opportunities in the IoT and automotive chipset markets.Chih-Wei Huang highlighted several applications of UWB. The first is the application of smart keys (Digital Key), which has now reached the 3.0 specification. The second is the application of in-vehicle UWB radar, used to detect whether infants or pets have been left in the vehicle accidentally, preventing serious regrettable incidents. The third is the issue of precise positioning, which involves confirming distance and accuracy. These new applications are tested and verified through standards such as IEEE 802.15.4ab, FiRa 2.0, and CCC PHY-test. Taking the IEEE 802.15.4ab standard as an example, it adds several test items, including Narrow-band Assistance (NBA) and Multi-Millisecond (MMS) test items. It introduces the testing of multiple Data Rate transmissions and sensing, emphasizing narrowband signal interaction (Offloading handshaking) transmission and fast transmission of small packets. To embrace the future development of UWB technology applications, LitePoint provides a comprehensive one-box testing solution, IQgig-UWB+, along with a one-stop testing solution for FiRa certification testing requirements and CCC PHY testing, satisfying the needs of the UWB industry for certification testing solutions.Chih-Wei Huang, team lead of applications

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and getting larger-sized AI chips require advanced packaging technologies to improve performance and time to market while reducing chip manufacturing costs and power consumption. The heterogeneous integration including 2.5D, 3D hybrid bonding, fan-out, and system-on-a-chip (SoC) packaging, along with emerging solutions like silicon photonics and panel-level packaging, are critical in optimizing system performance. These trending technologies are offering a higher-value opportunity and propelling the global semiconductor industry to foster the big waves of AI and high-performance computing chip innovation.The chemical solution providers play an important role in helping chip makers develop and commercializing various advanced packaging solutions to win premium customers. In this exclusive interview in the private conference room of SEMICON Taiwan with Mr. Ramachandran (Ram) Trichur, Global Market & Strategy Head for Semiconductor Packaging at Henkel Adhesive Technologies Electronics. He started recap the market observation of the semiconductor industry in 2024Henkel Adhesive Technologies business unit is the global leading chemical solution provider for adhesives, sealants, and functional coatings with sales of EUR10.790 billion in fiscal 2023. Henkel is the premier materials supplier for the electronics assembly and semiconductor packaging industries.Mr. Ramachandran (Ram) Trichur, Global Market & Strategy Head for Semiconductor Packaging at Henkel Adhesive Technologies Electronics.Expecting AI killer applications drive massive growth for edge computing Ram described the market as in a persistently challenging business environment as well as the market recovery in the Electronics business in 2024. Especially the advanced packaging is now gaining significant momentum as the next pathway for breakthroughs in semiconductor technology. The company expects single-digit market growth for 2024 and is optimistic about looking into 2025 as a massive increase in demand for the semiconductor market.He has observed several notable trends. First of all, in the past two years, generative AI has rapidly evolved and driven cloud computing AI revenue growth for enterprises. However, the volume of AI-enabled electronic devices is not increasing in the same way currently. The chip makers and electronic manufacturing industry are looking for applications to drive the unit count growth happened in the edge computing AI sector.Meanwhile, consumer electronics brands have quickly responded to promote their latest AI-powered products to figure out how consumers use AI to expand use cases that people use every day. There are more AI-enabled devices coming. Nowadays, some newly released fancy devices including AI personal computers (PC), AI smartphones, and intelligent robotics in automation systems are gathering attention. While companies race to incorporate AI technologies internally and externally, consumer use of AI still requires more time to see the results.Henkel hospitality suite showcasing solutions at SEMICON Taiwan 2024Photo: HenkelThermal mechanical challenges in advanced packagingSemiconductor chips are essential for the development and deployment of AI at scale. There are several primary challenges to be tackled in the semiconductor industry. Thermal-induced mechanical stress is now one of the leading causes of semiconductor failures, and it is becoming a top focus for chip manufacturers and ecosystem partners. "The bigger chips mechanically have big space and cause warpage and stress issues happened while ICs in operation," said Ram. He acknowledges the control of the warpage or mechanical stress to prevent chip failure is the highest priority for both material providers and chip manufacturers. The collaboration of ecosystem partners jointly developed and set a guideline on the maximum warpage or stress allowed in 3D-ICs, and designers could follow and avoid exceeding the constraints.Henkel is focusing on providing semiconductor packaging materials with long-term reliability, optimized performance, and processability for high throughput production. The demonstrated chemical solution lineups in SEMICON Taiwan 2024 include several major categories of advanced packaging materials. They are advanced underfill, non-conductive pastes & films (NCP & NCF), wafer-level encapsulation, and lid & stiffener attach materials.Lid & stiffener adhesives strengthening, warpage-reducing, grounding or shieldingRam divided the use of Henkel's materials for 2.5D/3D integrated packages in the manufacturing process into several highlights. The first is the lid & stiffener attach materials. The metal parts of lid & stiffener design in the larger-sized packaging is useful to reduce warpage concerns while dealing with tighter interconnects, thinner dies, complex architectures, and multiple coefficients of thermal expansion (CTE) in a single package. The Henkel's semiconductor adhesives are reliably attached to the lid and peripheral stiffeners to the substrate, allowing the package to maintain flatness throughout production and operational thermal cycles.During the manufacturing process and in operation, these devices and their multiple dies are subjected to several thermal cycles which can stress interconnects, leading to warpage and mechanical damage. The design of Henkel's lid & stiffener attach materials provides a portfolio of stability-enhancing adhesives ranging from conductive and non-conductive formulations, providing warpage-reducing coplanarity as well as grounding or shielding capability.Large die capillary underfill considering bump protection and warpage controlThe second highlight is focusing on advanced underfill materials. The 3D-IC design continues to increase the silicon interposer area to accommodate multiple dies including memory and processor units allowing the dense die integration inherent in advanced packaging techniques. This will require the underfill material with low shrinkage and toughness to provide die and underfill crack resistance, while its low coefficient of thermal expansion (CTE) protects against warpage. Targeting to meet the dimensional demands of highly integrated package designs, Henkel's Capillary Underfill(CUF) materials completely envelop fine-pitch, low gap height die interconnects for rigid protection against stress to deliver good electrical, moisture, and thermal reliability performance for high production yields.However, there is rising processability or manufacturing throughput requirements while the Capillary Flow Materials fill a large area in the substrate for bigger ICs. The flow speed allowing for greater process efficiency is an important feature for complete interconnect coverage. Henkel takes a quick response to release new materials. Taking Loctite Eccobond UF 9000AE as an example, in internal testing versus previous generation Capillary Underfills, Loctite Eccobond UF 9000AE demonstrated 20% faster flow on a 40 mm x 40 mm die, indicating that this material is compatible with even larger die sizes. So far, Loctite Eccobond UF 9000AE's performance has been validated on die as large as 50 mm x 50 mm and within packages up to 110 mm x 110 mm.Liquid compression molding materials support high reliability & high-UPH processThe third highlight is advanced molding and encapsulation materials. Wafer-level packaging shows significant growth potential, chemical solutions including advanced molding and encapsulation are enabling accelerated adoption by providing improved handling, protection, and warpage control for thinner die design approach. The challenges are the molding area is getting larger and the molding thickness is thin. The warpage becomes large after curing and it affects proceed to the subsequent process. Henkel's portfolio of wafer-level encapsulation materials include a variety of solutions to facilitate high-yield processing and in-field reliability for various advanced wafer-level packaging applications. The focus of the demo section is liquid compression molding materials (LCM).Henkel's liquid compression molding materials for wafer-level packaging processes integrate ultra-fine filler technology (less than 10 μm upper-cut) to deliver void-free gap filling and thorough coverage. In addition, the high warpage control and fast in-mold curing of Henkel's formulations molding materials provide high reliability in combination with a high-throughput process for overall lower cost. The LCM materials are anhydride-free and REACH-compliant, ensuring that the die remains protected under various operational stresses.Henkel Adhesive Technologies ElectronicsPhoto: HenkelHenkel Taiwan Electronics Adhesives Technical Center supports customers' technology roadmapsHenkel is well positioned to deliver the sustainable high-performance materials needed for next-generation advanced packaging. These series of Henkel's solutions offer characteristics with high reliability, thermal expansion, fast capillary flow to satisfy the requirements of complex, high-density semiconductor packages. In all product developments, Henkel's sustainability commitments to use renewable carbon content and eliminate Substances of Very High Concern (SVHC) materials will remain a priority. The newest generation of advanced packaging is integrated with the technologies with environmental protection and partnerships with industry leaders. This will drive the material innovation to satisfy the semiconductor manufacturing fab requirements.There are more versatile and potential opportunities for semiconductor advanced packaging technology underway including Co-Package Optics (CPO), panel-level packaging, and other emerging techniques. The next steps for Henkel Adhesive Technologies will continue investing heavily in material innovation and seek to understand the evolving needs of the semiconductor and electronic materials market while actively proposing chemical products that align with customers' technology roadmaps and contributing to the research and development of new products.Moreover, Henkel Taiwan Electronics Adhesives Technical Center at Zhubei City provides prompt technical support and increases collaboration with Taiwan customers to speed up prototype development. This application center is dedicated to supporting customers in technical innovation and product development through faster application simulation, data generation, and analysis, thereby accelerating time-to-market for advanced packaging technologies. Ram concludes, "Through Henkel's dedicated global support teams and in close partnership with customers, Henkel Adhesive Technologies will create technical breakthroughs to open a new frontier for semiconductor advanced packaging."

While the cloud offers a lot of benefits for businesses, it also presents new security challenges. As cyber threats become more sophisticated and frequent, businesses must be proactive in protecting their digital assets.Cloud threat modeling is a strategic approach that helps businesses identify, assess, and mitigate potential risks within their cloud environments. By simulating real-world attack scenarios, you can gain a deeper understanding of your vulnerabilities and develop targeted security measures. In this article, let's explore everything you need to know about the importance of cloud threat modeling.Cloud threat modeling: an introductionCloud threat modeling is an approach to identifying and evaluating potential security threats to cloud-based systems. It involves analyzing cloud architecture, applications, and data flows to identify vulnerabilities and predict how attackers might exploit them.By identifying these potential threats, you can develop strategies to mitigate them. This might involve implementing stronger security measures, training your team, or updating your software. Remember that threat modeling isn't a one-time event. It's an ongoing process that should be integrated into your cloud system's lifecycle.Why cloud threat modeling is critical for business securityProvides a proactive defenseInstead of waiting for a security breach to happen, cloud threat modeling will help you anticipate potential risks. By identifying vulnerabilities early on, you can implement preventative measures to protect your systems. This stance can significantly reduce the likelihood of data breaches, financial losses, and potential damage to your reputation.Helps enhance your understanding of the cloud environmentThe cloud can be a complex environment. Threat modeling provides a clear picture of this infrastructure, helping you to understand how different parts work together and where vulnerabilities might exist. This knowledge is crucial for designing effective security controls that protect the entire cloud ecosystem.Helps improve incident responseIf a security incident occurs, a well-developed threat model can be a valuable asset. It provides a roadmap for incident response teams, helping them quickly identify the root cause of the problem and take appropriate actions to contain and resolve the threat. This can minimize the impact of the incident and reduce downtime.Helps in compliance and regulatory requirementsMany industries are subject to strict data protection and cybersecurity regulations. Cloud threat modeling demonstrates a commitment to responsible security practices, helping you meet compliance requirements and avoid costly penalties. By proactively addressing risks, you can build trust with customers, partners, and regulators.It is cost-efficientDealing with the results of a security breach can be expensive. Cloud threat modeling helps prevent such incidents by identifying and addressing vulnerabilities before they can be exploited. This approach can save you money in the long run and allow you to allocate resources more effectively.Key components of cloud threat modelingAsset identification: Instead of simply listing assets, consider the value and sensitivity of each asset. Prioritize protection efforts based on the potential impact of a breach. For example, customer data might be more critical than internal documentation.Threat identification: Once assets have been identified, the next step is to identify potential threats. Go beyond common threats. Stay updated on emerging threats and attack techniques specific to your industry and cloud provider. Engage with security communities and intelligence sources to gain insights.Vulnerability assessment: Don't just list vulnerabilities. Understand the real-world impact of each vulnerability. Consider factors like the likelihood of exploitation, the severity of potential consequences, and the availability of patches or workarounds.Attack surface analysis: Instead of a static analysis, visualize potential attack paths. This helps stakeholders understand how attackers might exploit vulnerabilities to achieve their objectives. Use tools or techniques like threat modeling diagrams to make these paths more tangible.Mitigation strategies: Once threats, vulnerabilities, and attack surfaces have been identified, you must develop strategies to mitigate these risks. Involve a variety of stakeholders, including security experts, developers, and business leaders, in the mitigation planning process. Leverage their diverse perspectives to develop effective and practical security measures.Photo by Andrea Piacquadio from Pexels

Urbanization brings with it massive demand for parking spaces. The construction of smart parking systems then becomes an essential strategy for solving traffic problems and enhancing habitability. Taiwan International Development CO. (TIDC), ASUS MAAS, and the ASUS IoT business unit have formed a three-way partnership to develop the first all-in-one smart charger in Taiwan that combines charging, parking, and payment functions to satisfy the smart parking requirements of modern cities.ASUS IoT is committed to improving the quality of life in smart cities by using data and digital technologies as well as the in-depth integration of AI technologies, software, and hardware to implement smarter and more efficient city management solutions. AI technology can offer accurate prediction and analysis for improved system speed and accuracy. Software-hardware integration improves system stability and flexibility. More accurate license-plate recognition for smart parking systems reduces congestion, improves the utilization of parking resources, boosts the city's operating efficiency, and raises resident satisfaction. A superior living environment can be created by realizing the vision for smart and efficient city management.TIDC President Shi-chen Chen noted that chargers and parking systems face a plethora of challenges from smart city and net-zero carbon emission trends. The popularization of electric vehicles has created market demand for the installation of more charging facilities. These must be integrated with existing car parks and a reasonable billing mechanism set up. Parking management has already transitioned from tracking total volume to individual parking spaces. Smart functions such as license plate and vehicle model recognition must also be integrated into the system. In response, TIDC, ASUS MAAS, and ASUS IoT joined forces to help local governments throughout Taiwan develop their smart parking systems.Under the current collaboration model, TIDC is responsible for site management and customer service as well as collecting feedback on real-world applications and market demand. ASUS is the technology provider responsible for hardware such as smart bollards and chargers, and low-level software technologies – includes APIs and SDKs. ASUS MAAS plays the role of system integrator, integrating ASUS software and hardware to create full smart parking systems. According to ASUS MAAS, the model not only allowed the three vendors to respond rapidly to market requirements using their respective strengths but also engage in ongoing innovation on total smart solutions for the car park market.The ASUS MAAS all-in-one smart charger is based on the company's own X-Spotter system, an advanced smart parking system that includes several innovative features. The high-mount license-plate-recognition system can recognize the license plates of up to eight parking spaces at the same time and offers real-time parking space detection. The system also supports smart parking management and multiple payment methods for paperless parking. Multiple security functions such as intrusion detection have applications in residential and commercial scenarios. Integration with city-grade AI and EV energy-management platforms allows for energy analysis and management. The unobtrusive, low-interference design helps to maintain the aesthetics of the streetscape. The X-Spotter system will be upgraded in the future to support safety functions such as fire prevention, smoke detection, and anti-electricity theft to enhance the overall parking experience and management efficiency.The smart parking features of X-Spotter are powered by the PE1000-series edge AI system, an AIoT solution provided by ASUS IoT. ASUS AIoT Senior Business Development Manager Chih-wen Shih said that the business unit provides clients with one-stop smart city solutions. Product lines encompass the ARM architecture, NVIDIA JETSON series, as well as Intel and Windows solutions.The PE1000 series high-performance edge AI computer used in the X-Spotter incorporates the NVIDIA Jetson platform to support everything from Nano to Orin Nano and AGX Orin for different applications. Key features of the PE1000 series include fanless design, diversified I/O interfaces, WiFi and Bluetooth wireless connectivity, and optional 4G/5G communication modules for more flexibility on connections. The PE1000 series also supports a wide range of power inputs and operating temperatures to cater to different environmental conditions. ASUS Expansion Module (AEM) broadens its range of applications even more.TIDC has already rolled out smart car parks and electric vehicle charging facilities in a number of Taiwanese cities with the help of ASUS and ASUS MAAS. Taichung Civic Park Underground Parking Lot is planning to install 22 11kW slow chargers and four 120kW fast chargers. Tainan has installed 39 charging facilities already while Pingtung is planning to install 181 11kW slow chargers and four fast chargers. Fugang Geopark in Taitung has built and commissioned three charging facilities already, while the chargers installed at Wanfang Hospital in Taipei are seeing a high rate of use too.As for its future plans, TIDC indicated that the global electric vehicle industry is just taking off. A public behavioral model for charging, parking, and payments has not yet been established and legislation is still being drafted. Parking service systems must therefore make rolling adjustments to their architecture and functionality to keep pace with market requirements. The high performance and expandability of the PE1000 edge AI system provided by ASUS IoT combined with the flexible services of ASUS MAAS will help TIDC respond quickly to market changes and supply smart parking systems that deliver both management efficiency and a quality user experience.Taiwan International Development CO. (TIDC), ASUS MAAS, and the ASUS IoT business unit have formed a three-way partnership to develop the first all-in-one smart charger in Taiwan that combines charging, parking, and payment functions to satisfy the smart parking requirements of modern cities.

Asia's best solutions partner, EDOM Technology (TWSE: 3048), is partnering with Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, to showcase a series of innovative wireless connection technologies and solutions at electronica India 2024, including Bluetooth, Matter, Wi-Fi, and Wi-SUN. The exhibition lasts for three days (September 11-13), visit us at Booth F81, Hall 10, India Expo Mart (IEML), to learn more about our latest solutions in smart cities, smart homes, and industrial IoT.EDOM Technology and Silicon Labs have been collaborating for more than over 2 decades, jointly providing high-performance, low-power, and secure wireless connection solutions to countless clients. With the governmental policy support and extensive infrastructure investment, India is promoting large-scale infrastructure upgrades, which are supported by wireless technologies such as Wi-Fi and Wi-SUN. In addition, Bluetooth technology has also shown a strong growth trend in India's consumer electronics and Internet of Things device markets, becoming the core connection technology for these devices. The rise of the Matter protocol is expected to bring the fragmented smart home market into alignment, achieve better interoperability between devices, and thereby improve user experience.This year, in order to promote wireless connection technology, EDOM Technology joins hands with Silicon Labs to participate in Electronica India to showcase multi-protocol solutions. These solutions cover fields such as smart homes, smart meters, smart cities, and the Industrial Internet of Things (IIoT), providing wireless connections that meet client needs and help build a more convenient and connected future.The exhibition will showcase cutting-edge advancements in Bluetooth, Matter, Wi-Fi, and Wi-SUN technologies, offering visitors a chance to explore innovations across the IoT landscape. Key highlights include Bluetooth integration and optimization for various devices, with features like Bluetooth Mesh OTA firmware updates, remote provisioning, and Bluetooth LE PAwR, supporting large-scale, low-power bi-directional networks for industrial and commercial applications. Comprehensive Matter solutions will also be presented, including Matter over Thread and Matter over Wi-Fi. Additionally, Wi-Fi's low power consumption in battery-powered IoT devices, such as smart locks and home automation systems, ensures long battery life even during secure cloud connectivity and OTA updates, making it ideal for always-connected environments. Wi-SUN will further impress with its long-range, low-cost communication, providing real-time insights and enhanced network capacity for large-scale IoT deployments.electronica India provides visitors with a unique opportunity to gain insight into our latest breakthroughs in smart cities, smart homes, and industrial IoT. We look forward to sharing these technologies with you and exploring cooperation opportunities to jointly promote innovation in the wireless connectivity industry. For more details or to arrange a meeting, please visit Booth No. F81, Hall 10, India Expo Mart (IEML) and contact us: sales@edomtech.com.EDOM Technology joins Silicon Labs in Electronica India 2024 to promote innovative wireless connectivity technologies. Credit: EDOM Technology

In a world where quality standards are crucial to success, NewPower Worldwide is making an important move by joining the ANSI/ASQ Technical Advisory Groups (TAGs) 69 and 176. This decision places NewPower alongside respected organizations like CATERPILLAR, CISCO, INTEL, BOEING, LOCKHEED MARTIN, MICRON TECHNOLOGY, SCHNEIDER ELECTRIC, and GOOGLE. By becoming a member of this select group, NewPower seeks to actively contribute to the development and refinement of international quality standards, ensuring they meet the evolving needs of the industry and keep pace with technological advancements.As part of its responsibilities, the American National Standards Institute (ANSI) oversees U.S. Technical Advisory Groups (TAGs), which develop and transmit U.S. consensus positions on ISO standards. U.S. TAGs play a critical role in the approval, revision, and withdrawal of these standards while also selecting delegates to represent the U.S. at ISO meetings.NewPower's Commitment to Excellence and InnovationAs a member of TAG 69, which focuses on Applications of Statistical Methods, and TAG 176, dedicated to Quality Management and Quality Assurance standards, NewPower is positioned to influence the standards that govern global quality practices. This involvement reflects NewPower's dedication to pioneering quality initiatives that align with the company's vision of excellence and innovation.Pioneering New Standards: ISO 10009-2024NewPower's quality leadership was also engaged in the development and release of the ISO 10009 - 2024 standard, which serves as a companion to ISO 9001 and ISO 10017. This new standard provides quality practitioners with essential tools for structured problem-solving, encouraging their application in various contexts.By leveraging the guidance offered by the ISO 10009 - 2024 standard, organizations can achieve tangible benefits, including reduced complaints, minimized waste, faster turnaround times, improved responsiveness, and enhanced regulatory compliance. This standard serves as a valuable resource for quality practitioners, helping them enhance their quality management systems and overall effectiveness.The Future of Quality LeadershipNewPower's membership in ANSI/ASQ TAGs 69 and 176 marks a pivotal point in the company's journey toward setting a benchmark for quality leadership in the industry. By actively contributing to the development of international standards, NewPower is poised to influence the future of quality management practices. This strategic move enhances NewPower's capabilities and affirms its commitment to fostering a culture of quality that benefits both the company and the broader industry landscape.To learn more about NewPower's commitment to quality, visit www.newpowerww.com or email info@newpowerww.com.

Organized by the Taiwan External Trade Development Council (TAITRA), Taiwan International Water Week (TIWW) 2024, opened grandly today at the TWTC Exhibition Hall 1. This year, TIWW 2024 features nearly 100 companies and almost 200 booths, highlighting the active involvement of both domestic and international exhibitors from seven countries, including France, the United Kingdom, the United States, Denmark, Japan etc. TIWW 2024 established as a premier platform for industry professionals to explore cutting-edge innovations, forge partnerships, and pursue business opportunities within the global water resources sector.Mr. Simon Wang, the President & CEO of the Taiwan External Trade Development Council (TAITRA) emphasized the urgent global water crisis, noting that the accelerating effects of climate change have made effective water resource management crucial for sustainable development. This year's TIWW focuses on the themes of "Sustainable Water" and "Smart Water," with exhibitors showcasing groundbreaking technologies such as desalination, wastewater treatment, and recycled water systems, as well as smart equipment and intelligent water management systems, driving both innovation and sustainability within Taiwan's water industry.TIWW 2024 gathers the full spectrum of the water industry, presenting a wide array of solutions that encompass everything from essential components and equipment to fully integrated system planning. Notable exhibitors such as AVK, Winn & Coales (Denso), TA-DEE CHANG (TDC), KINGSHUENYI (KSE), Solteam Opto, EAGLESKY (ES), and KINGTRON are exhibiting cutting-edge products, including valves, pumps, meters, and other critical components. Leading water treatment companies like Veolia, LCY Chemical, the Industrial Technology Research Institute (ITRI), NOVAX, NALCO, WINRESP, TUNG HSIN CHANG (THC), and YUAN CHANG are showcasing their advanced water treatment technologies. Additionally, SYTECS, GUNG DAI, TANKPAC, Swun Chyan, and Multiply Industrial are unveiling filtration and clean water solutions. Meanwhile, KFR, UTRUST, FENRI, and ENERGY MANAGEMENT SYSTEM (EMS) are spotlighting smart water management systems powered by IoT technology.Beyond the extensive exhibits, TIWW offers a diverse array of activities throughout the event. Over the next three days, seventeen exhibitors will present their latest technologies and products. The Water Resources Agency (WRA) will host an international forum today (September 11) at the Taipei International Convention Center (TICC), focusing on critical water issues. On September 12, the TIWW Tech Talk session will feature presentations from Veolia Water, the Water Resources Agency (WRA), and the British Standards Institution (BSI), covering topics such as wastewater biological treatment technology, carbon neutrality in hydraulic engineering, and international standards trends. These sessions will facilitate discussions on water resource development trends and promote collaboration among academia, research institutions, and industry professionals.To assist exhibitors in expanding their global presence, TAITRA has mobilized over 60 overseas offices to arrange one-on-one procurement meetings between international buyers and Taiwanese exhibitors. This initiative aims to foster cross-border collaborations and help Taiwanese companies tap into global business opportunities and international buyers find suitable partners and solutions.Taiwan International Water Week 2024 will be open to visitors from today until September 13 at TWTC Hall 1. For further information about the exhibition, please visit the official website at https://www.taiwanintlwaterweek.com/en-us/index.html.