SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has recorded 24.4489 trillion won in revenues, 11.3834 trillion won in operating profit (with an operating margin of 47%), and 12.5975 trillion won in net profit (with a net margin of 52%) in the third quarter.Credit: DIGITIMESThe company achieved its highest-ever quarterly performance, driven by the full-scale rise in prices of DRAM and NAND, as well as the increasing shipments of high-performance products for AI servers. In particular, operating profit exceeded 10 trillion won for the first time in the company's history.As demand across the memory segment has soared due to customers' expanding investments in AI infrastructure, SK hynix once again surpassed the record-high performance of the previous quarter due to increased sales of high value-added products such as 12-high HBM3E and DDR5 for servers.Driven by surging demand for AI servers, shipments of high-capacity DDR5s of 128GB or more have more than doubled from the previous quarter. In NAND, the portion of AI server eSSD, which commands a price premium, expanded significantly as well.Building on this strong performance, the company's cash and cash equivalents at the end of the third quarter increased by 10.9 trillion won from the previous quarter, reaching 27.9 trillion won. Meanwhile, interest bearing debt stood at 24.1 trillion won, enabling the company to successfully transition to a net cash position of 3.8 trillion won.As the AI market rapidly shifts toward inference-driven workloads, there is growing interest in distributing computational loads of AI servers across broader infrastructures such as general servers. This trend is expected to further expand demand across the entire memory portfolio, including high-performance DDR5 and eSSD.In addition, the recent wave of strategic partnerships and AI data center expansion announcements by leading global AI players provides further momentum. This is expected to drive balanced demand growth not only for HBM, but also for various product lines including memory solutions for general servers.In response, SK hynix plans to accelerate the migration to its most advanced 1cnm process, or the sixth-generation of the 10-nanometer technology, which is already in stable mass production. This will enable the company to establish a full DRAM lineup across server, mobile, and graphics applications, and to flexibly respond to customer needs through expanded supply. In NAND, the company will also increase output of world's highest 321-layer TLC and QLC products to swiftly meet customer requirements.Meanwhile, the company has completed discussions with key customers regarding HBM supply for next year. HBM4, which completed development in September and entered mass production, fully meets customer performance requirements and supports industry-leading speeds. Shipments will begin in the fourth quarter this year, with full-scale sales expansion planned for next year.Furthermore, amid surging demand for AI memory, the company has already secured full customer demand for its entire DRAM and NAND production for next year.In order to address higher-than-expected customer demand, SK hynix plans to expand its production capacity through M15X, where equipment installation has recently begun after the early opening of a new cleanroom, and to accelerate the migration to advanced process technologies.As a result, investment for next year is expected to increase compared to this year, reflecting the company's continued commitment to a market-aligned investment strategy."With the innovation of AI technology, the memory market has shifted to a new paradigm and demand has begun to spread to all product areas," said Kim Woohyun, Chief Financial Officer. "We will continue to strengthen our AI memory leadership by responding to customer demand through market-leading products and differentiated technological capabilities."SK hynix 3Q25 Financial Results. SK hynix

Livestreaming has become a central part of Asia's digital life, spreading across shopping, gaming, entertainment, education, sports, and corporate sectors. Viewers can now watch everything from product launches to eSports tournaments in real time, often interacting directly with hosts or other audience members. Artificial intelligence is playing a big role in this growth.AI can provide real-time translations, auto-generated captions, and interactive overlays that make streams easier to follow. With faster internet and mobile technology, livestreams have become seamless experiences. Businesses, influencers, and content creators are using these tools to reach wider audiences, engage viewers, and create richer, more interactive broadcasts.Sports Streaming and In-Match FeaturesIn Asia, livestreaming is more than watching content. It is about interaction and immediacy. Platforms allow viewers to respond, ask questions, and even participate in polls or giveaways instantly. Sports fans in Asia can now watch matches live while accessing detailed analytics, player stats, and commentary simultaneously. AI-driven tools highlight scoring chances, track movements, and provide instant updates. For example, international betting sites, like non Gamstop sports betting platforms, integrate live betting, where viewers can adjust their wagers as events unfold, offering a highly interactive experience. Whether it is football, basketball, or martial arts competitions, live streams provide fans with insights that were once only available to professional analysts.This real-time access changes how audiences watch, follow, and participate in sporting events. Not only do these sites offer competitive odds and a variety of bet types, but users can often pay using crypto or e-wallets, adding flexibility. Watching a match this way is very different from traditional broadcasts, as every moment can affect decisions and strategies. This integration of live streams with betting creates a highly engaging experience that keeps audiences invested throughout an event.E-Commerce and Live ShoppingRetail has embraced livestreaming across Asia, turning product demonstrations into interactive shopping events. Platforms like Taobao Live, Douyin, Shopee, and Lazada allow influencers and brands to showcase products in real time. Viewers can ask questions about size, colour, or features while watching demonstrations.Many shopping events coincide with festivals or special promotions, driving huge sales. AI tools help highlight popular items, suggest similar products, and analyse viewer behaviour to make the experience more engaging. The combination of immediacy, interaction, and easy purchasing is transforming how people shop online, making livestreaming a vital sales channel.Gaming and eSports StreamingLivestreaming has reshaped the gaming scene in countries such as China, South Korea, Indonesia, and the Philippines. Players and fans watch tournaments, live matches, and speed runs on platforms like Douyin, Kick, and AfreecaTV. AI helps by automatically highlighting key moments, providing real-time stats, and moderating chat to keep interactions friendly.Viewers can now enjoy eSports with instant commentary and predictive analysis. Interactive features, such as live polls and fan competitions, create a sense of community while keeping the focus on the action. The combination of technology and interactivity makes gaming streams a leading form of entertainment across Asia.Media, Entertainment, and Live EventsLive performances, concerts, and cultural festivals are increasingly streamed to global audiences. Organisers use AI to improve camera angles, detect crowd reactions, and provide immersive experiences with AR and VR elements. Fans can watch in real time, comment, and share content on social media. Interactive features allow viewers to choose which performances or angles to follow.Streaming concerts or festivals offers a wider reach than traditional venues, bringing entertainment directly to people's devices. This accessibility is reshaping how audiences experience live shows while offering new opportunities for content creators and performers.Education and Corporate TrainingLivestreaming is also transforming education and business communications. Trainers can deliver live classes, workshops, or corporate presentations to students or employees across the region. AI assists by providing automated captions, translating lectures, and moderating questions in real time. Interactive quizzes and polls help maintain engagement, and analytics track participation and learning outcomes.For companies, live streams allow efficient communication, product demonstrations, or large-scale meetings without requiring physical presence. These tools are increasingly standard for schools, universities, and corporations looking to expand reach and efficiency.Technology Behind the StreamsThe growth of livestreaming relies on fast internet, widespread 5G coverage, and advanced mobile devices. AI enhances the viewing experience with features like automated highlights, translation, and smart camera control. Content creators can focus on producing engaging material while AI handles repetitive or technical tasks. This combination of human creativity and AI support ensures smooth, interactive broadcasts that attract and retain viewers. The rise of crypto payments, e-wallets, and flexible digital transactions also supports live commerce and live betting models.Livestreaming Across IndustriesFrom e-commerce and gaming to entertainment, education, sports, and corporate events, livestreaming is integrated into nearly every sector in Asia. Companies and creators now have the tools to engage audiences in real time, measure responses, and adjust content instantly. Interactive features such as live chats, polls, and tipping mechanisms make streams participatory rather than passive. AI-driven insights help identify popular content, analyse presentations, and tailor experiences to different audiences. The result is a digital ecosystem where livestreaming is central to business growth, entertainment, and communication.How AI is Revolutionising Livestreaming Across Asia's Expanding Digital Ecosystem. Credit: Pexels

SK hynix Inc. announced today that it presented its next-generation NAND storage product strategy at the '2025 OCP (Open Compute Project) Global Summit', held in San Jose, California, from October 13 to 16.SK hynix unveils AIN Family (P/B/D) and hosts HBF Night to expand the AIN B ecosystem. Credit: SK hynixSK hynix said that, with the rapid growth of the AI inference market, the demand for NAND storage products capable of process large volume data quickly and efficiently is increasing dramatically. The company will fulfill customer needs by establishing the 'AIN (AI-NAND) Family' lineup of solution products, optimized for the AI era.Chun Sung Kim, Head of eSSD Product Development at SK hynix, presented the AIN Family during the Executive Session on the second day of the event.The AIN Family consists of NAND solution products optimized for performance, bandwidth, and density respectively which is designed to enhanced data processing speed and storage capacity. AIN P (Performance) is a solution to efficiently process large volume data generated under large-scale AI inference workloads. The product significantly boosts processing speed and energy efficiency by minimizing the bottleneck between storage and AI operations. SK hynix is designing NAND and controllers with new structures and plans to release samples by the end of 2026.AIN D (Density) is a high density solution designed to store large amount of data with low power consumption and cost suitable for storing AI data. The company targets to increase density to petabyte (PB) level from terabyte (TB) of current QLC-based SSDs, and to aim for mid-end storage solution which implements both the speed of SSD and the cost efficiency of HDD.AIN B (Bandwidth) is SK hynix's solution leveraging HBF technology. This product expands bandwidth by vertically stacking multiple NANDs.With global top level HBM development and production capabilities, SK hynix has been conducting researches on AIN B from early stage to address the memory capacity gap driven by the expansion of AI inference and scaling up of LLMs. The key is to combine HBM's stacking structure with high density and cost efficient NAND flash. The company is taking various strategies for AIN B into consideration, such as placing together with HBM to enhance overall system capacity.SK hynix jointly hosted 'HBF Night' with Sandisk, after both parties entered an MOU for HBF standardization in August, to expand the technology ecosystem. The event was held at The Tech Interactive, near the OCP Global Summit venue, on the 14th.At the event, a panel discussion featuring Korean and foreign faculty members was held, with the participation of numerous industry architects and engineers participated. During the event, a collaborative effort across the industry was proposed to accelerate innovation in NAND storage products."Through OCP Global Summit and HBF Night, we were able to showcase SK hynix's present and future as a global AI memory solution provider, thriving in a rapidly evolving AI market," Ahn Hyun, President and Chief Development Officer said. "In the next generation NAND storage market, SK hynix will collaborate closely with customers and partners to become a key player."

Smiths Group plc ("Smiths") announces that it has entered into an agreement for the sale of Smiths Interconnect to Molex Electronic Technologies Holdings, LLC ("Molex", a Koch company) (the "Transaction"). The Transaction values Smiths Interconnect at an enterprise value of £1.3bn, representing 15.1x headline EBITDA of £86.1m1 for the fiscal year 2025. Smiths will receive cash consideration for the Transaction which is subject to customary adjustments for working capital, cash and debt. This announcement demonstrates clear progress against the strategic actions announced on 31 January 2025, designed to maximise value creation, unlock value in the portfolio, and enhance returns to shareholders. The sale of Smiths Interconnect is a notable step forward in the strategy to become a more focused industrial engineering company. Completion of the Transaction is expected to take place in the second half of fiscal year 2026.Credit: SmithsAs also announced in January, Smiths is executing against the delivery of enhanced returns to shareholders through its ongoing £500m buyback which is expected to complete by the end of calendar year 2025. Smiths remains committed to returning a large portion of disposal proceeds from the sale of Smiths Interconnect to shareholders and intends to maintain an investment grade credit rating with the desire to have an efficient balance sheet.  The Board of Smiths will provide an update on the use of proceeds in the Q1 FY2026 Trading Statement scheduled for release on 19 November 2025. Smiths continues to progress with both the sale and demerger processes in parallel for Smiths Detection, as previously stated.Roland Carter, Chief Executive of Smiths, said: "This is an important step as we deliver on our commitment to focus Smiths and unlock the inherent value in our business. Today's announcement, and our recent results, show we are delivering on our strategy with pace and purpose and I am confident that we will continue to do so as we further focus our business as a high-performing industrial engineering company.""We thank our Smiths Interconnect colleagues for their significant contribution to the Smiths Group over many years and wish them every success as they transition to their new owner, Molex, who is well placed to support their future growth."Under French employment laws, prior to making any decision to enter into the Transaction (including by way of entry into any binding share purchase agreement), Smiths is required to carry out an information and consultation process with its French works council (the "French Works Council"). It is intended that the consultation process regarding the Transaction will begin following this announcement.Whilst Smiths will ensure the views of the French Works Council are properly considered, the French Works Council opinion on the Transaction is consultative and not binding on Smiths or Molex.Following completion of the consultation with the French Works Council, the agreement that Smiths has entered into gives it the unilateral and unconditional right to require Molex to enter into a binding share purchase agreement to complete the Transaction, which is subject to the satisfaction of customary conditions and regulatory approvals.Based on headline FY2025 EBITDA, which excludes the contribution from the US sub-systems business unit of Smiths Interconnect, which was reported as agreed for sale in Smiths full year 2025 results, and which completed in October 2025.

As digitalization penetrates every industry-whether in cloud computing, telecommunications infrastructure, automotive electronics, or IoT devices-the security of hardware platforms is no longer an isolated concern of a single sector, but a common challenge faced by all critical infrastructures. In the past, the focus of cybersecurity was largely placed on software.However, as attack methods continue to evolve-from supply chain infiltration and firmware tampering to chip-level exploits-the security and resilience of hardware have come to be recognized as a fundamental cornerstone of modern security architectures. At the heart of this shift, Secure Flash Memory is increasingly emerging as the critical enabler across diverse application domains.Secure Flash Memory is becoming the common language of cybersecurity across industries.Credit: WinbondEvolution of International Standards: Hardware and Firmware Security FrameworksIn recent years, international standards and certification frameworks for hardware and firmware security have gradually formed a tightly interwoven network. Among them, the NIST SP 800-193 Platform Firmware Resiliency (PFR) Guidelines established by the U.S. National Institute of Standards and Technology clearly define three core capabilities: detection, protection, and recovery.These requirements mandate that platforms be capable of identifying anomalies, blocking unauthorized updates, and securely restoring firmware when necessary. Initially widely adopted in servers and networking equipment, SP 800-193 is now regarded as a cornerstone for defending against firmware-level attacks.However, relying on a single framework alone is insufficient to address the diversity of application scenarios. To provide a more flexible and scalable approach that covers varying product types and market demands, the Security Evaluation Standard for IoT Platforms (SESIP) was introduced. Designed specifically for IoT and embedded platforms, SESIP emphasizes a modular approach to security evaluation.By decomposing security functionalities into reusable security claims, SESIP not only improves certification efficiency but also allows manufacturers to reuse existing security assets across product lines, avoiding the need to start from scratch for each market-specific requirement. This flexibility has made SESIP a critical tool in today's rapidly expanding landscape of IoT and smart devices.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.The Convergence of Industry Standards: Common Criteria, FIPS 140-3, and ISO/SAE 21434At the same time, other international security frameworks continue to exert their influence. Common Criteria (ISO/IEC 15408) remains one of the most widely recognized global security evaluation systems, providing stringent assurances for smart cards and critical infrastructure devices. FIPS 140-3, mandated by the U.S. government, sets clear requirements for the security of cryptographic modules, covering encryption, key management, and physical protections, and has been broadly adopted in finance, government, and cloud services.Additionally, ISO/SAE 21434, originally designed for the automotive sector, introduces a risk-based approach to cybersecurity lifecycle management. While its initial focus was on automotive electronics, its methodology is increasingly being extended to other safety-critical domains, highlighting the growing convergence of cross-industry security standards.Though these standards originate from different perspectives, they share a common foundation: ensuring the establishment of a Root of Trust, safeguarding firmware and cryptographic keys against tampering, and enabling systems to recover quickly after an attack.This is precisely where secure flash memory demonstrates its value. The latest generation of secure flash memory devices typically integrate multiple security mechanisms, such as secure boot support, immutable key storage, hardware-based authentication, and cryptographic accelerators.These features allow secure flash memory not only to meet the firmware integrity requirements of NIST SP 800-193 but also to align with the cryptographic module protections defined in FIPS 140-3 and to complement the modular security claims of SESIP. In other words, secure flash memory is not just a solution for one certification, but rather a bridge across multiple international standards.Practical Applications: Secure Flash Memory in Different Industry SegmentsFor example, in the server domain, secure flash memory ensures that both BIOS and BMC firmware are verified during startup, blocking any unauthorized modifications in real time-a direct embodiment of PFR principles. In IoT devices, the same memory can be evaluated through SESIP, modularizing secure updates and key management, thereby enabling shared security foundations across different product lines.In financial services or cloud platforms, the built-in cryptographic engines of secure flash memory directly support the requirements of FIPS 140-3, providing a trusted environment for key storage. In automotive electronics, these memories can be incorporated into the threat modeling and risk management frameworks outlined in ISO/SAE 21434, supporting end-to-end lifecycle security management.Secure Flash Memory as the Engine of Cross-Industry Digital TrustIt can therefore be said that the role of secure flash memory has moved far beyond being a mere data storage component; it has become the tangible foundation of a system’s Root of Trust. It is the essential vehicle through which security standards are realized and the shared language that enables cross-industry collaboration. As industries worldwide continue to raise the bar for cybersecurity, the ability to effectively integrate and align with multiple international standards will determine whether products can successfully enter the market and earn end-user trust.Looking ahead, as supply chain security challenges intensify—from manufacturing to system integration to end applications—the demand for security will only continue to grow. With its unique ability to span across multiple standards, secure flash memory is poised to remain the cornerstone of digital trust in industry. It is not merely a technological option, but a strategic necessity for companies seeking to maintain competitiveness and compliance in the global marketplace.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) recently wrapped up in Shenzhen. Themed "AI Applications, Innovation Empowered, "GMIF2025 represented as a gathering of leading enterprises, technical experts and industry leaders across the memory sector to explore pathways for technological evolution and emerging opportunities driven by AI. Kevin Yoon, VP and CTO of Memory Division from Samsung Electronics, delivered a keynote titled "Architecting Al Advancement: The Future of Memory and Storage", unveiling a series of cutting-edge solutions and providing a glimpse into the challenges and innovation directions of memory technologies.Kevin Yoon, VP and CTO of Memory Division from Samsung Electronics. Credit:GMIFMemory is Embracing an Architecture Reconfiguration with the Advent of Agentic AI EraAccording to the address by Kevin Yoon, AI is evolving from Generative AI to Agentic AI and will progress toward Physical AI. The memory industry is now officially transitioning into the Agentic AI era. Characterized by independent inference and decision-making capabilities, the Agentic AI is demanded to maintain multiple states over time built on top of generative AI and invoke external tools without noticeable latency. This shift is fueling explosive growth in global data and computing workloads."The inference of Agentic AI requires longer periods to achieve optimal outcomes, resulting in surging needs of memory capacity," Kevin Yoon underlined, data centers are transitioning into data-intensive computing mode in a fast manner. Therefore, memory technologies goes beyond a backend underpinning to become the determinant of AI system efficiency and scalability. Legacy storage architectures are faced by exponential bandwidth demands, power consumption nearing physical limits, and increasing latency constraints, so the memory hierarchy must be restructured to meet the needs of next-generation intelligent infrastructure.Dual-Track Advances in Memory: Samsung Mass Produces GDDR7 and Leads the CXL EcosystemRegarding high-bandwidth needs of AI servers, Kevin Yoon announced its major breakthroughs. Its first-ever 24Gb GDDR7 in mass production establishes deep collaborations with leading GPU partners. Engineered with leading-edge process and optimized IC architecture, it delivers transfer rate up to 42.5Gbps, a 30% enhancement in energy efficiency compared to last-gen products, making it stand out in AI training and graphics rendering.Compute Express Link (CXL) stands as a promising solution to address the capacity limit of DRAM. Samsung, the first to debut CXL products, has already mass-produced CXL 2.0 products benefited by its technology and ecosystem development since 2021. Kevin Yoon noted that as the industry moves into the CXL 3.0 era, Samsung is developing devices that support real-time memory sharing across multiple servers. A CMM-D solution with CXL 3.1 and PCIe Gen 6.0 compatibility is scheduled for launch next year, with plans to add full-feature support such as near-memory processing to further improve flexibility and scalability in data centers.All-Around Innovation: Advancing Performance, Density and Thermal ManagementIn memory sector, Kevin Yoon introduced Samsung's technology layout and product roadmap in terms of three major indicators: high performance, high density and thermal control. On the performance front, Samsung is tackling the challenges posed by interface upgrades to PCIe through coordinated design across NAND and controllers and is planning to launch its PCIe Gen6 SSD PM1763 in early 2026. This brand-new versions is expected to offer doubled performance under the power consumption limit of 25W and a 1.6-fold energy efficiency improvement, making it ideally suited to GPU-intensive AI computing scenarios.With respect to high-density storage, Samsung is clearly ahead of the pack. It launched a 128TB U.2 SSD in 2025 and plans to roll out 1T-thickness EDSFF products between 2026 and 2027, pushing capacities to 256TB on Gen5 and 512TB on Gen6. These leaps are powered by Samsung's advanced 32-layer stacked packaging and the slim form factor of EDSFF, enabling higher density and better energy efficiency in limited space.To address the thermal challenges of high-performance storage, Kevin Yoon explained that Samsung is pivoting from traditional air cooling to direct liquid cooling technologies. By reducing the thickness of its E1.S 8TB SSDs from 15T to 9.5T and minimizing thermal resistance between cold plates and enclosures, this will ensure system stability under full-load conditions for next-generation storage products.New Product Category: Memory Class Storage Ushers in a Low-Latency EraTo support the rapid-access needs of AI inference on small data blocks, Samsung introduced a new category called Memory Class Storage (MCS), designed to close the performance gap between storage and compute. A key use case is GPU Initiated Direct Storage (GIDS), where data moves directly between storage and the GPU, dramatically cutting system latency.The company is now developing seventh-generation Z-NAND, the key medium behind MCS. Its third-generation product, tailored for GIDS, is expected to deliver throughput well above current industry benchmarks while maintaining ultra-high performance and peak energy efficiency. "Memory Class Storage will reset expectations for AI inference speed and underpin real-time intelligent applications," Kevin Yoon emphasized.In closing, Kevin Yoon stated that through full-stack innovation in memory and storage, Samsung not only aims to solve AI-era data management challenges but also unlock the full potential of AI technologies. Moving forward, Samsung will continue to push technical boundaries and work with global partners to build an open storage ecosystem and co-create an intelligent future empowered by AI.Honored for Excellence: Outstanding Storage Technology Leadership AwardThe GMIF2025 Innovation Summit, in addition to in-depth discussions of technological evolution and ecosystem collaboration in the AI era, also announced an award list that highlighted outstanding enterprises, innovative technologies, and exemplary solutions that have emerged in the storage field over the past year. As an industry leader, Samsung Semiconductor has continued to make major strides in both DRAM and NAND technologies and was honored with the "Outstanding Storage Technology Leadership Award."Samsung Semiconductor honored with Outstanding Storage Technology Leadership Award. Credit:GMIFThe judging committee noted that as AI fuels surging demand for high-bandwidth, energy-efficient storage, Samsung has moved fastest in bringing advanced technologies like HBM, DDR5, LPDDR5X and high-stack 3D NAND into large-scale production and real-world use. These innovations have helped accelerate large-model training, data-center upgrades and next-generation smart devices, giving global customers a much stronger technology backbone.The award also reflects Samsung Semiconductor's long-term investment in R&D and its role in continuously pushing the limits of storage performance and enabling digital transformation worldwide. The company reaffirmed that it will keep driving memory innovation, deliver cutting-edge solutions across the ecosystem and help advance AI adoption globally.GMIF2025 brought together top industry leaders and the keynote by Kevin Yoon offered a clear view of where storage technology is heading in the AI era. From agentic AI and breakthroughs in GDDR7 and CXL to progress in high-density storage and thermal design, Samsung is clearly at the forefront. Its introduction of Memory Class Storage adds an entirely new approach to AI inference. Moving forward, Samsung will continue working with partners around the world to unlock the next wave of storage possibilities and power an AI-driven intelligent future.

Blockchain technology is steadily reshaping mobile gaming, introducing new systems for payments, fairness and transparency. As decentralized finance expands into consumer services, gambling platforms are emerging as an example of how blockchain can alter both digital infrastructure and user experience. The rise of digital assets is now most visible in the growth of mobile crypto casino platforms, which illustrate how blockchain is merging with on-the-go entertainment.The Evolution of Mobile Gaming and Cryptocurrency IntegrationOver the last few decades, the shift in mobile gaming has been unprecedented due to the accessibility of powerful smartphones and the widespread availability of the internet. Mobile gaming is now the primary means of digital gaming in developed and emerging markets, capturing the most gaming revenue in 2024.Cryptocurrency has rapidly expanded and is now widely used for many transactions. In 2024, approximately $40.9 billion of illicit transactions within the crypto space were conducted, mostly using stablecoins. Although the figure reflects illicit activities, it demonstrates how powerful blockchain technology is.The integration of these industries has facilitated the development of mobile crypto casino platforms. Users replacing traditional fiat casino transactions with Bitcoin and other cryptocurrencies have made international transactions almost instant. The reduction of delays because of traditional banking has made it quite appealing to mobile crypto casino users.Blockchain as Infrastructure for Transparency and TrustUsing blockchain technology in the crypto gaming industry increases trust and confidence in transactions, which is a common challenge in the crypto gaming industry. Automated deposits and withdrawals of crypto can expose the illicit activities of a casino. Blockchain technology can provide real-time transparency, thus building trust for players in the gambling sitePlayers can check the fairness of gambling games through "provably fair" systems. Distributed ledger technology (blockchain) improves auditability in gambling. Unlike traditional gambling systems, where payments are settled in days, blockchain gambling payments are settled in minutes, particularly useful in regions where digital payments are embedded with middlemen.Global Growth and Regulatory ConsiderationsThe global gambling market is uneven due to blockchain technology. In North America, regulatory restrictions at the state level reduce the likelihood of widespread adoption. European and Latin American countries are using controlled regulatory sandboxes to test and monitor the technology. The Philippines has digitized its licensing system and Australia is adapting its regulations to mobile-first systems.According to Grand View Research, the latest data indicates the online gambling market is currently valued at 78.66 billion dollars and is projected to reach 153.57 billion dollars by 2030, reflecting an almost 12 percent annual growth. This means that the online casino market is projected to grow from 19.11 billion dollars in 2024 to 38 billion dollars by 2030. This means that blockchain-enabled platforms will positively impact the overall growth of the market, with the limit being the regulators' actions towards new emerging technologies.Market Adaptation and Case StudiesAdaptation across the sector has culminated in mobile-first cryptocurrency convergence. The growing cryptocurrency blockchain payment networks will be integrated with entertainment systems, reflecting a shift in consumer expectations toward quick, transparent services.For developers and analysts, there are both opportunities and challenges. There is demand for quicker and less restricted services, but also compliance issues, cybersecurity threats and the absence of international laws. The ability to weigh user convenience against operational resilience will determine long-term profitability.The absence of definitive answers does not change the reality that mobile crypto casinos are a growing trend. They are a test of blockchain technology in consumer markets and a demonstration of how mobile technology and digital currency combine to provide services that are transparent, effective and scalable.However, regardless of which tools or platforms seem most promising, careful evaluation is essential before taking action. Success in this space depends not only on innovation, but on understanding the legal, technical, and ethical implications of each solution.Blockchain Integration Reshapes Mobile Gaming Platforms. Pexels

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond. Taiwan's industry leaders are at the forefront of this transformation, proactively developing next-generation packaging technologies critical to AI semiconductor content.AI workloads are driving demand for specialized chip architectures that can process massive amounts of data quickly and efficiently. In data centers, high-performance AI chips-such as GPUs or AI accelerators-support large-scale model training and inference for applications like AI chatbots. At the edge, devices rely on high-efficiency chips like NPUs to enable real-time decision-making in applications such as autonomous vehicles, smart cameras and mobile devices.This shift in computing architecture depends on advanced packaging. By enabling higher performance and power efficiency through a tighter integration of compute and memory, advanced packaging supports the sophistication and scale of modern AI chips. Taiwan's expertise in advanced packaging and its expansive semiconductor supply chain are accelerating this shift.Why Heterogeneous Integration is Key to PerformanceMoore's Law scaling is becoming more expensive due to the complexity needed to keep increasing transistor counts. As a result, innovation is diversifying. Technologies like high numerical aperture extreme ultraviolet (high-NA EUV) lithography and new transistor designs such as gate all around (GAA) continue to push traditional scaling. Developments with backside power delivery (BPDN) are improving overall raw performance by providing a more stable power supply. Breakthroughs in semiconductor packaging are now playing an increasingly pivotal role.Semiconductor packaging has evolved beyond protecting and connecting chips to powering device performance. At the heart of this shift is heterogeneous integration-the ability to combine multiple chips or chiplets in a single package. This modular approach offers a flexible, cost-effective way to integrate diverse functions in packaging instead of on a single chip, to meet requirements without relying solely on traditional scaling.Advanced Packaging Technologies Enabling AIAI chips are growing in complexity, with some expected to contain up to a trillion transistors per package by the end of the decade. Advanced packaging supports this growth through system-level integration of compute and memory.High bandwidth memory (HBM) plays a key role. By stacking memory vertically and placing it close to the GPU, HBM reduces latency and boosts data transfer speeds while lowering power consumption. Interposers and substrates facilitate efficient communication between components. In many modern AI designs, hundreds of logic and memory chips are integrated into a single high-value package to meet specifications.Credit: KLATo support the growing architectural demands and evolving semiconductor chip requirements, the industry is advancing 2D, 2.5D and 3D packaging architectures-where 2D places chips side-by-side on a substrate, 2.5D arranges them on an interposer and 3D stacks them vertically. Technologies like hybrid bonding, embedded bridges, wafer- and panel-level interposers, glass core substrates and co-packaged optics help to increase interconnect density and improve system performance. These innovations provide new ways to shorten signal paths to increase bandwidth and reduce power loss-critical for AI workloads.Advanced Packaging Innovation Brings Manufacturing ChallengesAs packaging complexity increases, so do manufacturing challenges. More chip designs per package, larger die sizes, smaller features, denser interconnects and new materials all raise the bar for packaging yield management.Credit: KLAWith more components and interconnects placed into a single package, the number of potential failure points increases. A single chip or interconnect defect can compromise the entire multi-die package-resulting in costly yield loss. In this environment, tighter process control becomes essential to ensure high yield and reliability.Heterogeneous integration brings challenges similar to those found in front end semiconductor manufacturing, demanding greater defect sensitivity and tighter metrology precision. KLA addresses these challenges with a comprehensive portfolio of advanced packaging process control and process-enabling solutions-for wafers, panels and components – designed to scale advanced packaging complexity without compromising quality.Evolving 2.5D and 3D packaging architectures create new yield challenges that need improved process and process control solutions.Credit: KLAAI Needs Intelligent IntegrationThe semiconductor industry is anticipated to reach US$1 trillion globally by 2030, according to PwC in November 2024, driven by a wide range of applications-including the rapid growth of AI from data centers to edge devices. AI demands high compute capacity with optimized power use, pushing the boundaries of semiconductor chip design and integration. Taiwan’s semiconductor manufacturers welcome these opportunities.It's widely recognized that 90% of the world's advanced semiconductors are produced in Taiwan, contributing to a combined semiconductor output value that exceeded NT$5 trillion in 2024, up 22.4% from 2023, according to statistics released by the Industrial Technology Research Institute (ITRI). Global demand for AI chips is surging.AI is also driving a diversification of semiconductor content. Wide band gap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) provide higher power density, faster switching, and better thermal efficiency than silicon, making them increasingly important for efficient power delivery in AI systems.In data center and HPC environments, AI growth is also pushing development in photonics and co-packaged optics for network switches to improve data transfer speeds and energy efficiency. Quantum computing, still in early stages, could eventually reshape how complex AI workloads are processed.Across these domains, advanced packaging serves as the foundation for uniting diverse technologies into compact, high-efficiency systems. Taiwan technology leaders are driving this advanced packaging innovation, and KLA is proud to serve as their collaborative partner.2025 marks the 35th anniversary of KLA's operations in Taiwan. Headquartered in the United States, KLA is a global leader in semiconductor inspection and metrology, with over 15,000 employees worldwide. The expertise and insights cultivated at KLA Taiwan over three decades, in partnership with our valued customers, underscore a commitment to technical excellence in the AI era-when chip manufacturing requirements are more complex and challenging than ever before.The future of semiconductors isn't just about smaller transistors – it's about smarter integration. Packaging has become essential to performance. At the boundaries of Moore's Law, advanced packaging has emerged as the key to meeting next-generation semiconductor device requirements.With deep expertise in process, process control and customer collaboration, KLA is helping the semiconductor industry build what comes next. As AI redefines what's possible, the technologies that support it must evolve just as rapidly. KLA's dedicated team of engineers, physicists and data scientists embraces the scale and significance of this transformation, helping shape the future of semiconductor innovation in the AI age-where advanced packaging plays a pivotal role.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) was successfully concluded recently in Shenzhen. Under the theme "AI Applications, Innovation Empowered", the GMIF2025 of the year brought together leading representatives across the global memory industry chain to engage in in-depth discussions on compute-storage convergence, AI deployment, and ecosystem collaboration, exploring pathways for storage technology innovations and ecosystem development in the AI era.Wallace C. Kou, President and CEO of Silicon Motion. Credit:GMIFWallace C. Kou, President and CEO of Silicon Motion Technology Corporation, was invited to deliver a keynote speech titled "From Cloud to Edge: Silicon Motion's Controller Technologies Accelerate AI Application Innovation." Wallace offered an in-depth analysis of the transformation of storage architectures in the AI era and showcased Silicon Motion's latest breakthroughs and product roadmap in controllers under AI.In his keynote, Wallace highlighted that as AI shifts from training to inference, data volumes are surging from PB to ZB levels. Traditional storage architectures are increasingly inadequate for the stringent needs of AI, particularly in high throughput, low latency, and energy efficiency. AI applications are pushing the memory industry evolving from "tiered storage" to "compute-storage convergence" and even "in-memory computing", making storage no longer merely a "warehouse for data" but a critical part of the AI computing pipeline."The rapid development of AI has made storage an indispensable core element in the entire value chain," said Wallace, "From cloud data centers to edge devices, AI inference will become the dominant trend after 2026. With leading controller technologies, Silicon Motion is building a full-stack storage solution that spans cloud, edge, and endpoints."Data Centers: The PCIe Gen5 SSD controller SM8366 supports sequential read/write speeds of 14GB/s and 3.5M IOPS random reads/writes. Equipped with Silicon Motion's in-house LDPC error-correcting algorithm, it ensures high reliability for high-capacity QLC SSDs.Edge & AI PCs: The PCIe Gen5 SM2508 series is in mass production with over 50% global market share. It supports the SCA interface and low-power design, making it ideal for AI PCs, all-in-one systems, and edge servers.Automotive & Embedded: The Ferri-SSD, Ferri-UFS, and Ferri-eMMC product families are purpose-built for harsh operating environments. Certified to the AEC-Q100 standard, this product lineup features wide-temperature tolerance, high reliability, and superior data integrity to meet storage needs in autonomous driving systems.Ecosystem Synergy: A Call for Industry CollaborationWallace emphasized that the future of AI storage requires deeper industry collaboration and urged stakeholders across the value chain to join forces to address the potential storage chip shortages forecasted for 2026. He noted that demand will surge due to the rise of AI inference devices, the popularization of TB-level storage in smartphones, and explosive growth in IoT terminals, while production capacity remains insufficient.Despite global uncertainties tied to geopolitics and tariffs, the structural demand for storage driven by AI remains unchanged. Wallace predicted 2026 will mark an inflection point for AI inference and edge AI, and Silicon Motion is well-positioned to seize this new growth cycle."From GPU Direct Storage to DPU architectures, from cloud to edge, no single company can achieve product innovation alone," Wallace said. "Silicon Motion will continue deep collaboration with NVIDIA, cloud service providers, and OEM/ODM partners to jointly build a thriving AI storage ecosystem."Award Recognition: "Outstanding Controller Technology Innovation Award"At its booth, Silicon Motion also showcased its latest-generation products, including SM2508, SM2504XT, SM2708, SM2324, SM2264XT-AT, and SM2268XT2-AT, as well as cutting-edge technology platforms such as MonTitan, FDP (Flexible Data Placement), PerformaShape, Ferri-SSD, Ferri-UFS, and Ferri-eMMC. SMI highlighted the value these solutions deliver to downstream device development, technological innovation, and industry applications.At its booth, Silicon Motion also showcased its latest-generation products. Credit:GMIFIt's worth noting that GMIF2025 had recognized the outstanding enterprises, innovative technologies, state-of-the-art solutions in the storage and memory sector over the past year, and the award list was concurrently released.Silicon Motion received the "Outstanding Controller Technology Innovation Award" in recognition of its leadership and innovation in controller technologies.According to the judging panel, Silicon Motion has demonstrated forward-looking technical deployment by being among the first to launch high-performance PCIe Gen5 SSD controllers. The company has also achieved continuous breakthroughs in key areas such as low-power architecture, firmware algorithm optimization, and AI acceleration solutions, significantly enhancing the performance, efficiency, and reliability of memory products. Its innovative solutions are widely deployed in PCs, portable devices, and enterprise markets, providing strong technical support for global ecosystem partners.Silicon Motion stated that the award reflects high recognition of the company's long-term R&D commitment and innovation strength. Looking ahead, the company will continue to explore frontier technologies and expand the boundaries of storage with more advanced and reliable controller products to empower the digital era.SMI Honored with"Outstanding Controller Technology Innovation Award". Credit:GMIFFrom cloud to edge, AI is reshaping the value map of storage and memory and remodeling the innovation dimensions of controllers. The insights shared by Wallace at GMIF2025 were beyond a technological vision and more of an open invitation to industry co-creation. As the world races into the Zettabyte era, industry progress will be collective-or not at all.Silicon Motion's achievements are demonstrated through the extreme performance of PCIe Gen6, large-scale deployment of Gen5, and stringent automotive-grade reliability, proving that controllers can act as the "invisible engine" driving leaps in AI computing power. Being honored with the "Outstanding Controller Technology Innovation Award" makes that dedication visible to the industry and trusted by partners. The storage landscape in 2026 will be a battleground of demand and supply, but only synergy across chips, systems, cloud, edge, and devices can turn scarcity into shared opportunity.By refining controllers into the key that unlocks innovation and scale, performance and efficiency, present and future, Silicon Motion is ready for the next leap-together with its ecosystem partners-to open the next door of AI storage and memory, where every byte of throughput becomes a step forward for intelligent computing.

As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between processors and memory. Even with continuous improvements in processor performance, if data cannot be delivered in real time, overall system efficiency remains limited.To overcome this bottleneck, Die-to-Die high-speed interconnect and HBM4/PHY IP integration have emerged as critical technologies for next-generation AI and HPC chip designs.Progate Group Corporation(PGC), a member of the TSMC Design Center Alliance (DCA), leverages its ASIC turnkey expertise and participation in the Synopsys IP OEM Program to deliver advanced design capabilities comparable to leading international players-while offering a more cost-effective, high-value service model that helps global customers accelerate AI and HPC deployment and mass production.Technical Highlights: Comprehensive Support from Design to ProductionPGC provides one-stop technical services, supporting clients from chip design to production. The coverage includes high-speed interconnects, memory integration, foundry certifications, and AI/HPC application-oriented designs, helping clients shorten time-to-market efficiently.Die-to-Die Interconnect and Chiplet ArchitecturePGC offers advanced expertise in Die-to-Die interconnect and Chiplet-based system design, supporting 2.5D and 3D integration technologies to enable high-speed, low-latency, and low-power chip-to-chip communication. All solutions are compliant with the Universal Chiplet Interconnect Express (UCIe) standard, ensuring interoperability and scalability across heterogeneous and cross-supply-chain environments.This capability addresses the growing demand for high-bandwidth and flexible multi-die integration, empowering customers to build next-generation Chiplet-based systems with enhanced performance and modularity.HBM4 / PHY IP IntegrationLeveraging Synopsys-certified IP, PGC enables rapid integration of HBM4 memory and PHY interfaces to shorten design cycles while strengthening design reliability. These high-bandwidth memory solutions help design teams overcome data transfer bottlenecks and achieve terabyte-per-second (TB/s) throughput, meeting the stringent performance requirements of AI and high-performance computing (HPC) applications.TSMC DCA Certification AdvantageAs a certified member of TSMC's Design Center Alliance (DCA), PGC provides end-to-end design-to-tape-out support within the TSMC's ecosystem. Customers can leverage TSMC's CyberShuttle multi-project wafer (MPW) program to conduct rapid prototyping and design validation, followed by seamless transition to mass production through PGC's ASIC turnkey services. All designs are fully compatible with advanced packaging technologies such as Wafer-on-Wafer (WoW) and 2.5D/3D integration architectures within major foundry ecosystems, ensuring a smooth and efficient path from prototype to production.AI / HPC Application FocusPGC's dedicated ASIC designs are optimized for AI and high-performance computing (HPC) applications, spanning AI accelerators, data center chips, and high-speed network switch devices. These designs support AI training, HPC simulation, and large-scale data processing workloads, meeting the performance, power, and scalability requirements of next-generation computing environments.Ecosystem IntegrationPGC's services are closely aligned with TSMC's advanced foundry ecosystem, combined with Synopsys-certified EDA and IP solutions, to deliver a complete ASIC turnkey flow covering: High-speed interface IP - ASIC design service - process support - packaging service - verification - testing - mass production.In addition to its own testing equipment and validation capabilities, PGC maintains long-term partnerships with multiple advanced test houses, enabling precise analysis for high-frequency, high-speed interface and advanced-node devices.This level of integration significantly reduces design risk and accelerates time-to-market, while ensuring that the design results are fully compatible with mainstream advanced packaging technologies - such as 2.5D/3D integration and wafer-on-wafer architectures within major foundry ecosystems - as well as international standards including UCIe.PGC delivers high reliability, low risk, and accelerated time-to-production through its comprehensive ASIC turnkey services, allowing customers to focus on differentiated design and market innovation. By leveraging its proven engineering expertise and established partnerships across the semiconductor supply chain, PGC helps customers reduce overall design and ASIC development costs, enhance design success rates, and improve product stability.In addition, PGC provides cross-regional engineering and project management support spanning Taiwan, Japan, China, and the United States - empowering global deployment strategies for AI and HPC applications with consistent quality and technical alignment.PGC provides complete ASIC turnkey services supporting 2.5D/3D advanced packaging technologies.Credit:PGC