China-based Jiangyin Changdian Advanced Packaging (JCAP) is setting up chip-scale packaging lines and wafer-bumping lines, slated for mass production next year, according to sources.
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China-based Jiangyin Changdian Advanced Packaging (JCAP) is setting up chip-scale packaging lines and wafer-bumping lines, slated for mass production next year, according to sources.
