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COF-use flexible PCBs to fall short of demand by 30% in 2005

Amy Lee, Taipei; Steve Shen, DIGITIMES Asia Wednesday 6 April 2005 0

The supply of flexible PCBs used in the COF (chip on film) packaging process for LCD-driver ICs in the Taiwan market will likely fall short of demand by 30% in 2005, predicted Gray Huang, president of International Semiconductor Technology (IST), a...

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