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Synova revolutionizes wafer dicing – A cleaner, gentler cut

Chris Hall, DigiTimes.com, Taipei Friday 16 September 2005 0

Synova SA is poised to revolutionize wafer dicing with its innovative laser-microjet (LMJ) technology, where a hair-thin low-pressure jet of water guides the laser while simultaneously absorbing heat and washing away debris. The technology has numerous...

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