IC substrate maker Kinsus aims to double flip chip substrate capacity to 120 million by mid-2007

Amy Lee, Hsinchu; Esther Lam, DIGITIMES Asia Wednesday 15 February 2006 0

IC substrate maker Kinsus Interconnect Technology aims to double its flip-chip substrate production capacity to 120 million chips by the middle of 2007 and will secure funds via share and global depositary receipt (GDR) issues. The raised funds will...

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