REALTIME NEWS

Kinsus extends COF packaging presence by acquiring Qualibond assets

Amy Lee, Hsinchu

Oct 12, 2005, 16:23 0

Not long after releasing news about its potential interest in acquiring a COF (chip on film) substrate maker, Kinsus Interconnect Technology announced that it will purchase COF substrate maker Qualibond Technology’s equipment, according to a company filing...

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