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PTI developing advanced packaging technologies

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Friday 1 July 2011 0

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear fruit in 2012-2013. The company also added that subsidiary Macrotech...

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