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IC backend set for tepid growth in 2H15, says ASE COO

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 24 June 2015 0

The global IC packaging and testing industry has been working through excessive inventory for almost two quarters, but is set for tepid growth in the second half of the year, according to Tien Wu, COO for Advanced Semiconductor Engineering (ASE).

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