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SPIL looks to effective results of SiP packaging development with Foxconn

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 2 September 2015 0

Siliconware Precision Industries (SPIL) expects its strategic partnership with Foxconn Electronics for developing SiP (system-in-package) packaging technology to begin bearing fruit within one year, according to company chairman Bough Lin.

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