DDI packaging and testing to continue to grow in 2022: Q&A with Chipbond CEO Wu Fei-Jain

Julian Ho, Taipei; Eifeh Strom, DIGITIMES Asia Friday 1 October 2021 0

Chipbond CEO Wu Fei-jain. Credit: DIGITIMES

Since the outbreak of the COVID-19 epidemic, the global electronics supply chain has been bogged down by the effects of the "broken chain," uneven component supply, and frequent price increases due to the IC shortage.

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