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Winbond to boost 20nm chip output at new fab in southern Taiwan

Siu Han, Taipei; Jessie Shen, DIGITIMES Asia Monday 14 February 2022 0

Winbond president Pei-Ming Chen. Credit: DIGITIMES

Specialty DRAM and flash memory chipmaker Winbond Electronics expects to ramp up monthly output at its new 12-inch fab in Kaohsiung, southern Taiwan to 10,000 wafers by the fourth quarter of 2022 and further expand the fab output with another 10,000...

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