CONNECT WITH US

Winbond to boost 20nm chip output at new fab in southern Taiwan

Siu Han, Taipei; Jessie Shen, DIGITIMES Asia 0

Winbond president Pei-Ming Chen. Credit: DIGITIMES

Specialty DRAM and flash memory chipmaker Winbond Electronics expects to ramp up monthly output at its new 12-inch fab in Kaohsiung, southern Taiwan to 10,000 wafers by the fourth quarter of 2022 and further expand the fab output with another 10,000...

The article requires paid subscription. Subscribe Now