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Hanmi won HBM equipment orders from Micron, Samsung next?

Daniel Chiang, Taipei, DIGITIMES Asia Monday 15 April 2024 0

Credit: Hanmi

In recent years, due to the development of the High Bandwidth Memory (HBM) market, the thermal compression (TC) bonder equipment produced by Hanmi Semiconductor has attracted attention. Besides supplying SK Hynix, it has recently signed an HBM TC bonder...

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