As semiconductor technology advances towards 1-2 nanometer (nm) processes, extreme ultraviolet (EUV) lithography equipment is undergoing generational changes. The next-generation Hyper-NA EUV, expected to debut in 2030, is set to become a significant factor in the strategic planning of TSMC, Samsung Electronics, and Intel.
According to South Korean media outlet Chosun Biz, ASML plans to introduce Hyper-NA EUV equipment in 2030, capable of supporting sub-1nm processes. This follows the High-NA EUV systems, which ASML began supplying to Intel in 2024.
EUV lithography machines offer higher resolution, enabling the creation of more intricate circuit patterns. They also increase production efficiency, simplify manufacturing processes, and enhance chip performance. However, the exorbitant cost of these machines has given major players pause.
Current EUV systems are priced at approximately US$180 million each, while the new High-NA EUV costs around US$360 million. The upcoming Hyper-NA equipment could potentially exceed US$720 million per unit. ASML reports that major industry players have already placed orders for High-NA EUV systems, although the implementation timelines may vary.
Dr. Kevin Zhang, Senior Vice President of Business Development at TSMC, has stated that while High-NA EUV offers excellent performance, its price is prohibitively expensive. He suggested that TSMC's current EUV equipment should be sufficient to achieve A16 (1.6nm) technology.
Industry analysts predict that TSMC, which adopted EUV technology later than Samsung, will likely maintain its strategy of maximizing existing EUV equipment. The company is expected to focus on multiple patterning techniques and carefully evaluate the scale of new equipment adoption to minimize investment burdens.
Samsung is also deliberating on the timing of High-NA equipment adoption. Considering its long-term roadmap for sub-1nm processes, the company may skip High-NA EUV and directly implement Hyper-NA systems. However, the reliability and pricing of Hyper-NA equipment remain uncertain, posing significant risks.
Intel, the first to adopt High-NA EUV, has faced financial challenges. Its foundry division reported a US$7 billion loss in 2023 and continued to operate at a loss in the first quarter of 2024. Industry observers attribute this partly to the cost burden of early adoption of next-generation EUV equipment.
ASML states that the High-NA EUV systems supplied to Intel can handle processes from 2nm down to 0.7nm. For future sub-1nm processes, Hyper-NA EUV technology will become indispensable.
