Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.
Interview: Andhra Pradesh moves to become India's semiconductor packaging hub
Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of Computex, Bhaskar Katamneni, Secretary to the Government for ITE&C, acknowledged that wafer fabrication remains a long-term "seven or eight-year journey," but said packaging work is already well underway — with four PCB manufacturers having already begun operations, according to him.
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Article edited by Jack Wu