TSMC announced plans in 2020 to establish an advanced wafer fab in the US, marking a major shift toward significant US investments. Initially seen as a political necessity, TSMC's US expansion has evolved over five years into a long-term commitment exceeding US$165 billion, supporting American manufacturing ambitions

DIGITIMES has recently published three latest research reports regarding Qualcomm's cloud AI ASIC business strategy for 2026, the status of the worldwide top-3 memory makers, plus the latest trends of the memory industry, and an update to DIGITIMES' estimate of global smartphone shipments in 2026 as a result of ongoing price hikes of memory

If today's AI data centers are blazing "powder kegs" of heat, IBM was the visionary that prepared the "fire extinguisher" half a century ago. While Nvidia's top chips now require water cooling to operate, few realize that this technology's "biological father" actually dates back to IBM in the 1960s. Today, we explore this groundbreaking US patent 3,524,497 ("Patent 497") and its blue-cooling revolution spanning over 50 years

For years, smart glasses and augmented reality (AR) headsets were among the most visible attractions at the Consumer Electronics Show (CES), peaking in 2025 when they dominated the exhibition floor. At CES 2026, their presence was noticeably reduced. This does not point to an industry slowdown. Rather, it signals the sector's exit from the "concept phase" and its entry into a market defined by price competition and practical commercialisation

At the opening of his keynote, Nvidia CEO Jensen Huang delivered a stark message: the world's US$10 trillion computing infrastructure is entering a fundamental modernization phase, driven by two platform shifts unfolding in parallel

China's Ministry of Industry and Information Technology, together with eight other government departments, has released the plan for "AI + Manufacturing." While framed as an industrial upgrade policy, it functions in practice as a strategically significant AI roadmap

China has intensified pressure on Japan's supply chains. Following curbs on dual-use items and rare earth exports, the Ministry of Commerce has launched an anti-dumping probe into Japanese-origin dichlorosilane (DCS)

China's Ministry of Commerce said on January 7, 2026, that it has launched an anti-dumping investigation into Japanese-origin dichlorosilane (DCS). While framed as a routine trade-remedy case under existing rules, the decision reflects a more specific reality in the semiconductor materials supply chain: China now has domestic fallback capacity in this critical process material, allowing policymakers to act selectively at a sensitive juncture

Recent supply-chain signals suggest that OpenAI has shifted hardware orders from Luxshare to Foxconn, a move widely interpreted as preparation for highly interactive, portable AI devices. While specifications remain undisclosed, industry sources believe the products will emphasize real-time interaction tightly coupled with cloud-based AI, pointing to a new class of always-connected endpoints rather than conventional consumer electronics

The US AI sector stands at a crossroads. After years of breakneck infrastructure expansion, cracks are beginning to show in the financial foundation supporting this boom

The global economic landscape underwent three major transformations in 2025: the Great Rebalancing, the evolution of the AI supercycle, and a US industrial revival driven by national security considerations

Post-pandemic inventory digestion for mature semiconductor processes has come to an end. Market conditions have rebounded amid tariff-hedging and precautionary stocking, driving Taiwan's leading packaging lead frame supplier, Chang Wah Technology, to see rising demand for high-end products in the second half of 2025. The company has also accelerated capacity expansion plans across Taiwan, China, and Malaysia

Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and 2nm capacity is largely locked in. Advanced packaging now contributes a growing share of sales. The company is on track to see annual revenue exceed US$250 billion around 2029 or 2030. That widening gap has pushed Japanese companies to focus on panel-level packaging and nanoimprint technologies. Both emerged at SEMICON Japan 2025 as key levers to bypass manufacturing bottlenecks and secure a foothold in the fast-expanding AI accelerator supply chain

Artificial intelligence continues to be the central force behind the upcoming productivity revolution. Yet in the US, foundational energy constraints threaten to stall progress. The primary obstacle is not a shortage of semiconductor chips or inadequate computing capacity. It is a more fundamental resource: electricity. Increasing demand from AI data centers (AIDCs) is straining the nation's electric grid. It is testing the limits of social tolerance

The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade Statistics (WSTS) forecast, released in December 2024, expects growth to be driven predominantly by logic chips, including GPUs and AI accelerators. Memory markets are poised for the steepest increase