Qualcomm China chairman Frank Meng introduced the "AI Acceleration Initiative" at a Beijing event on September 24, aiming to enhance collaboration across China's industrial ecosystem and accelerate large-scale adoption of edge AI technologies. The initiative was unveiled during Qualcomm's Snapdragon China conference, which included participation from major smartphone and automotive companies via video
Samsung Electronics is expected to confirm by late September 2025 that its 12-layer fifth-generation high-bandwidth memory (HBM3E) has cleared customer validation, South Korean media reported. The announcement would end Samsung's earlier silence and signal to the market that its technology is keeping pace with competitors
On September 22, DeepSeek released the upgraded DeepSeek-V3.1-Terminus model through its API platform and quickly made it open source. The update fixed user-reported issues, but once again, the highly anticipated DeepSeek-R2 reasoning model failed to appear
At Huawei Connect 2025, Huawei rolled out its Ascend 950, 960, and 970 AI chips with a three-year roadmap, headlined by the Ascend 950's new "P/D separation" design. The architecture splits large language model (LLM) inference into distinct tasks, making it the standout highlight of the launch
China is fast-tracking the BeiDou Navigation Satellite System (BDS), broadening its ecosystem from core infrastructure to commercial applications and positioning it as a global platform, not just a domestic project
Xiaomi founder Lei Jun said in his September 25 keynote livestream that the company will invest at least CNY50 billion (US$7.01 billion) over the next decade in self-developed chips, prioritizing smartphone SoCs. He called semiconductors central to Xiaomi's path toward becoming a global technology leader and a cornerstone of its long-term growth
SK Hynix is reportedly set to begin producing GDDR7 memory on its sixth-generation 1c DRAM node, a 10nm-class technology. Likely customers include long-standing partners Tesla and Nvidia. The company plans to match production to product launch schedules, with a mass ramp-up of 1c GDDR7 targeted for 2026
The global race to build the future of technology just got dramatically more expensive. TSMC is reportedly planning a staggering 50% price increase for its next-generation 2nm chips. The move is squeezing top American clients like Qualcomm, Broadcom, and AMD, and opening the door for rival Samsung to launch a strategic counter-offensive with deeply discounted wafers
China's Ministry of Commerce (MOFCOM) announced on September 25, 2025, that it has launched a trade and investment barrier investigation into Mexico's proposed plan to raise tariffs on imports from non-free trade partners, including China. The move follows a proposal published in Mexico's Congress Gazette on September 9, 2025, which outlined adjustments to multiple import taxes
China's growing demand for high-bandwidth memory (HBM) is reshaping its chip sector. Yangtze Memory Technologies Co. (YMTC), long centered on NAND flash, is planning to expand into DRAM to produce HBM for artificial intelligence chips, according to three sources cited by Reuters. The plan underscores Beijing's urgency to boost domestic chipmaking after the US expanded export controls in December 2024, restricting China's access to HBM
The largest Tokyo Game Show in history, TGS 2025, opened on September 25, 2025, for a four-day run, drawing massive crowds eager to experience the latest in gaming technology. A standout highlight this year was the surge of AI-driven innovations—particularly generative AI—which wowed attendees with immersive game content and AI-powered hardware designed to enhance user experience while reducing energy consumption
The global semiconductor industry is entering an unprecedented growth phase driven by artificial intelligence, with market forecasts projecting the sector to exceed US$1 trillion by 2030
On September 24, Xiaomi founder Lei Jun confessed on Weibo that launching both cars and chips at once was like "supporting two children through college." The pressure, he said, was immense, with Xiaomi staking the financial reserves it had accumulated over its first decade
Micron Technology has, for the first time, overtaken Samsung Electronics in the high-bandwidth memory (HBM) market, securing second place in global shipments during the second quarter of 2025. According to data from Counterpoint Research, Micron captured a 21% share of HBM shipments, edging out Samsung's 17%, while SK Hynix remained the undisputed leader with 62%
China is ramping up its nuclear fusion drive with the launch of a new state-backed firm. China Fusion Energy Co., a wholly owned subsidiary of China National Nuclear Corporation (CNNC), was founded in Shanghai in July 2025 and made its public debut on September 24, 2025, at the 25th China International Industry Fair (CIIF), emerging as the nation's newest "national team" player in the fusion race
