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Friday 21 August 2026
Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the way. Supply-chain sources say the chip has already returned from fabrication, completed initial power-on testing and moved into the device integration stage.
Friday 21 August 2026
JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance computing lifting capacity utilization and accelerating the shift toward higher-value advanced packaging.

Friday 21 August 2026
SK Hynix weighs Japan memory fab in Miyagi, but says no investment is final
SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision has been finalized.
Friday 21 August 2026
HP Korea localizes AI strategy with Upstage in healthcare, finance
HP Korea is sharpening its localized AI strategy through a partnership with large language model (LLM) startup Upstage, and has already moved into AI transformation (AX), eyeing demand from document-heavy industries such as healthcare and finance. Built around high-performance AI workstations, the company is offering an end-to-end pipeline from scanning and inference to printing, helping HP break out of its image as only a PC supplier in the South Korean market.
Friday 21 August 2026
Goertek reports higher revenue and profit in 1H26
Chinese electronics manufacturer Goertek reported higher revenue and profit for the first half of 2026, supported by growth in its smart acoustic products and continued investment in R&D.
Friday 21 August 2026
China's new solid-state battery standards could reshape the industry
China has introduced the world's first national standards for automotive solid-state batteries, setting off market speculation that most of the country's more than 320 players may ultimately fail to meet the new bar. The rules tighten definitions, safety testing, and mass-production expectations, shifting competition from concept claims to engineering proof and industrial readiness.
Friday 21 August 2026
Alibaba's 45% AI cloud jump masked by 75% capex surge and margin squeeze
Alibaba Group's June quarter is the clearest statement yet that the company now runs as an AI infrastructure business with an e-commerce cash engine attached, rather than the other way around. Revenue rose 9% year-over-year to CNY268.95 billion (US$39.64 billion), but the composition of that growth, and the cost of buying it, matter more than the headline.
Friday 21 August 2026
JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities towards denser 2.5D and 3D integration.
Friday 21 August 2026
Elice to build South Korea's first warm-water-cooled AI data center, unveils coding agent
South Korean AI infrastructure provider Elice Group is expanding on two fronts, adding enterprise AI transformation (AX) solutions while building what it says will be the country's first AI data center to use warm-water cooling above 40°C.
Friday 21 August 2026
Korean display makers step up OLED patent push as China narrows technology gap
Korean display makers are stepping up patent licensing and cross-border enforcement as Chinese rivals have sharply narrowed the technology and market-share gap in OLED since 2020, just as competition expands into higher-value panels for notebooks and monitors.
Friday 21 August 2026
China silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump
National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued R&D spending, currency movements and inventory impairments widened its net loss.
Friday 21 August 2026
Samsung holds off on High-NA EUV until 1nm production
Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier hoped to introduce the technology at the 2nm and 1.4nm nodes.
Friday 21 August 2026
China's humanoid robot shipments hit 40,000 in the first half of 2026
China shipped more than 40,000 humanoid robots in the first half of 2026, lifting its share of global shipments to 97%, according to a development report released on August 20 at the 2026 World Robot Conference in Beijing. The figure marked the highest share ever recorded in the report's historical data and underscored China's growing role in the global humanoid robot supply chain.
Friday 21 August 2026
DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy," DIGITIMES chairman Colley Hwang said on August 20 at a forum exploring future trends in the semiconductor industry. He also warned that Taiwan's AI data center capacity is about one-sixth of South Korea's.

Friday 21 August 2026
Longcheer and Luxshare move into robot ODM
China consumer electronics ODMs are extending their R&D, supply chain integration and mass production capabilities into the embodied AI robot market. Longcheer announced on August 19 that it had signed an agreement with the Nanchang High-tech Zone in Jiangxi, officially establishing an embodied AI robot R&D and manufacturing base. The company said it will build end-to-end capabilities from product definition and R&D design to engineering delivery, offering ODM solutions for embodied AI products.