Leveraging Singapore as its regional hub, Huawei has expanded hardware deployments, such as servers, across data centers in the Association of Southeast Asian Nations (ASEAN) region. Following the US revocation of certain Intel chip export licenses to Huawei in 2024, the Chinese tech giant has aggressively adopted its proprietary Kunpeng chipsets, resulting in a dramatic increase in Kunpeng shipments to ASEAN data centers and telecom base stations, according to DIGITIMES Intelligence.
Industrial gas supplier Linde LienHwa is expanding its industrial decarbonization applications, with oxygen-enriched combustion technology adopted by Taiwan Cement, Walsin Lihwa, Jin Lian Cheng Resources, and LoToun Steel, among other major companies. The technology cuts exhaust volumes and improves combustion efficiency, increasing production capacity by more than 50% and reducing fuel consumption by up to 50%; the company is also joining partners across the logistics, transportation, and hydrogen industries to advance a hydrogen-as-a-service (HaaS) model.
Indian semiconductor engineering services firm Tessolve has raised US$75 million from US-based Vector Line Capital and says it is in advanced discussions to close multiple acquisitions over the next couple of quarters, as the Hero Electronix company pushes deeper into designing AI and high-performance computing chips.
Chinese researchers have demonstrated wafer-scale graphene quantum rectifiers that convert weak radio-frequency signals into DC electricity at room temperature without an external magnetic field. The development offers a potential route towards integrating wireless energy-harvesting devices into conventional semiconductor manufacturing processes.
SK Hynix has unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage bottlenecks as AI data centers demand faster and more efficient access to data.
Samsung affiliates plan to invest a combined KRW12.26 trillion (approx. US$9.18 billion) in semiconductor operations across South Korea and Vietnam, but the projects face different financial and supply-chain challenges. Samsung Electronics plans to finance about 63% of its Vietnamese memory testing investment through future profits, while Samsung Electro-Mechanics (SEMCO) faces potential equipment delivery delays and material supply constraints as it expands semiconductor substrate production.
ATE Energy International Co. Ltd. reported consolidated revenue of NT$6.667 billion (US$209.0 million) for the first three quarters of 2026, up 132.52% from a year earlier, driven by the continued progress of major energy engineering projects in the Philippines and steady recognition of engineering revenue.
Advanced Micro-Fabrication Equipment (AMEC) chairman and general manager Gerald Yin has warned of a potential AI investment bubble, cautioning that surging demand for chipmaking equipment does not shield the semiconductor industry from cyclical swings in capital expenditure.
Rising capital expenditures by global cloud service providers (CSPs) are accelerating orders for AI computing infrastructure, boosting both the specifications and volumes of passive components and driving strong third-quarter 2026 results for Taiwan suppliers including Yageo, Walsin Technology, Holystone Enterprise, Lelon Electronics, Tai-Tech, Apaq, Ta-I Technology, Viking, and Thinking. The capacity crunch is extending lead times for capacitors and resistors, while suppliers are preparing for another round of price increases as demand visibility stretches beyond 2027.
Shenzhen-based Blue Core Computing (Shenzhen) Technology has raised nearly CNY2 billion (≈ US$298.7 million) in Series B financing to accelerate production of its RISC-V server processors with integrated AI capabilities. The funding follows the deployment of its LX500 chip in Lenovo servers, advancing China's efforts to develop alternatives to x86 and Arm architectures.
China's Hua Hong Group has signed strategic agreements with four domestic semiconductor equipment suppliers to accelerate the adoption of locally developed wafer fabrication tools, reinforcing China's chipmaking self-sufficiency efforts. The partnerships coincide with Hua Hong's ambitious 2030 market-share targets for specialty processes, including embedded flash memory, power management, and image sensors.
Japan's Omron has agreed to acquire US industrial computer (IPC) maker OnLogic and its parent company, Interlogic, at an enterprise value of US$675 million, seeking to expand its presence in Western markets and combine rugged edge computing with its factory automation and control technologies.
Huawei's cumulative global foldable smartphone shipments have exceeded 20 million units, with the company capturing more than 70% of China's foldable phone market in the first half of 2026, according to Huawei Terminal BG CTO Li Xiaolong.
As the global AI industry and AI data centers (AIDCs) experience explosive growth, developing compute hubs presents severe power supply challenges alongside stringent international supply chain mandates for carbon reduction and renewable energy usage. Amid grid transition friction and resilience tests, state utility Taipower, alongside Taiwan's renewable energy, energy storage, and domestic lithium battery cell sectors, is pursuing a two-track strategy combining decarbonization with grid resilience via novel dispatch mechanisms and a localized supply chain.
After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process node. Capacitive coupling between the floating gates of adjacent memory cells increasingly disrupted their threshold voltages, making stored data harder to read reliably. The problem became particularly acute with the adoption of triple-level cell (TLC) NAND, which requires precise threshold-voltage detection. Changes in the charge stored by neighbouring cells could alter those voltages, making further planar scaling increasingly difficult.
