Google was scheduled to launch the first fully customized Tensor chip for its Pixel smartphones in 2024, but it has reportedly postponed the plan to 2025 and is said to be planning...
Samsung Electronics plans to apply its in-house developed advanced packaging technology in 3nm GAA process manufacturing by 2025, but frontend manufacturing yields continue to play...
Samsung Electronics has disclosed its latest advanced process development roadmap at the just-ended 2023 Samsung Foundry Forum, with plans to mass produce 2nm chips by 2025 and commercialize...
Due to the bandwidth limitations of DDR SDRAM in high-speed computation, high bandwidth memory (HBM) is rapidly gaining popularity as a means to circumvent memory transmission speed...
China's semiconductor industry, whether in IC design or wafer manufacturing, is currently facing challenges from deglobalization. Wei Shaojun, a professor at Tsinghua University and...
High-end handset application processor (AP) demand is unlikely to pick up until next year, and it will return to a normal growth track in 2024-2025, according to sources at backend...
Germany-based automotive supplier ZF continues to scale up its localization in China. On Tuesday, the company broke ground on its third e-mobility plant in recent years. The facility,...
Germany-based automaker Mercedes-Benz recently obtained its second permit in the US for its L3 autonomous driving technology, Drive Pilot. As 2025, thought to be a watershed year...
Samsung Electronics has announced that its newest automotive processor, the Exynos Auto V920, will be used to power Hyundai Motor Company's next-generation in-vehicle infotainment...
Takeshi Kataoka, SVP and GM of Renesas Electronics' automotive solutions is in Taiwan for the second time this year and will deliver a remark at a Computex 2023 forum on Friday (June...
United Microelectronics Corp. (UMC) continues to observe customers adjusting inventory levels, albeit at a slower rate than expected, while cyclical shifts in the business climate...
Touch solution provider General Interface Solution (GIS) will undergo a transformation to focus on developing optical components and modules catering to AR/VR/MR, automotive heads-up...
MediaTek plans to introduce its first 3nm automotive chip in 2024, followed by mass production as early as 2025, according to Jerry Yu, senior VP and GM of the company's CCM divisi...
Ford Motor announced that its EV customers will be able to charge with Tesla Superchargers in the US and Canada next year. Moreover, Ford plans to integrate the connector of the supercharger...
