Intel has brought forward the mass-production schedule of its new 32nm processor codenamed Clarkdale to the fourth quarter of 2009 from the originally planned first quarter of 2010,...
Samsung Electronics recently began sampling 35nm-made NAND flash chips with its controller IC design partners, a signal that the market for 30nm-class NAND flash is likely to heat...
Globalfoundries is scheduled to break ground for its new facility (Fab 2) at the Luther Forest Technology Campus in New York in July, according to Tom Sonderman, the foundry's vice...
Intel executive Sean Maloney today (June 2) said his company's relentless commitment to innovation will help drive tremendous future growth throughout the computing and communications...
KLA-Tencor today (May 13) launched the AcuShape 3D software modeling tool, developed with Tokyo Electron, to meet optical dimension metrology requirements for the 32nm node and bel...
Toshiba has announced that it will start shipping NAND flash memory products fabricated with 32nm process technology. Samples of the 32nm-generation, 32Gb single chips (4GB) are available...
Taiwan Semiconductor Manufacturing Company (TSMC) has said it is on track to increase manpower within its R&D and design service units by 30% and 15%, respectively, while proceeding...
Intel will debut its new notebook platform (Calpella) in the third quarter of 2009, but will launch only three new processors (Clarksfield) to accompany the new platform this year,...
IM Flash Technologies, a joint venture between Intel and Micron Technology, may overtake Hynix Semiconductor and become the third-largest NAND flash supplier worldwide in 2009, according...
Globalfoundries, the spin-off of AMD's former manufacturing operations, is working to build its customer base in Taiwan and Japan, according to company CEO Doug Grose. Grose, who...
China's Advanced Micro-Fabrication Equipment (AMEC) has cut into the supply chain of Taiwan Semiconductor Manufacturing Company's (TSMC's) 12-inch fabs, with its 45nm etcher, which...
Intel president and CEO Paul Otellini has announced the company will spend US$7 billion over the next two years to build advanced manufacturing facilities in the US. The investment...
Following rumors speculating that Xilinx is likely to start cooperating with Taiwan Semiconductor Manufacturing Company (TSMC) for its next-generation 32nm FPGA (field-programmable...
Xilinx is said to have included Taiwan Semiconductor Manufacturing Company (TSMC) among its potential foundry partners for 32nm FPGA (field-programmable gate array) manufacturing,...
