Micron Technology has begun sampling what the company claims is the industry's first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The...
China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment...
Micron Technology has announced volume production on its 8Gb GDDR6 memory, which is optimized for a variety of applications that require high performance memory including artificial...
After scoring impressive revenue and profit records in 2017, Taiwan-based logic IC packaging firm Greatek Electronics, an affiliate of Powertech Technology (PTI) , is quite optimistic...
Taiwan-based logic IC packaging and testing specialist Greatek Electronics is expected to enjoy stable revenue growth in the first quarter of 2018 from increasing ratio for orders...
Macronix International has announced its new Ultra-OctaFlash Memory designed to meet the growing demand for "instant-on" performance and real-time system responsiveness in automotive,...
Samsung Electronics has begun mass producing NVM Express (NVMe) PCIe SSD solutions in a single ball grid array (BGA) package for next-generation PCs and ultra-slim notebooks, according...
Revenues generated at Unimicron Technology's new flip-chip ball-grid array (FC BGA) substrate plant will reach NT$500 million (US$15.3 million) per month in 2016, up from about NT$350...
IoT devices, which have been receiving a great deal of attention from the global ICT industry have several major characteristics: versatility, reliability, security, small-size, mobility...
Commenting on Intel's reported plans of abandoning CPU socket designs and changing to directly soldered CPUs after two years, Asustek Computer vice president and general manager of...
Though several major IC packaging material suppliers have resumed operations at their earthquake-affected plants, there is still growing concern that production will be hampered by...
Nanya PCB (NPC) plans to drop its capital spending from NT$5 billion (US$171 million) in 2010 to less than NT$1 billion in 2011, as most of its investment for expanding capacity for...
Despite receiving a favorable ruling in a US International Trade Commission (ITC) over a patent infringement lawsuit brought by Tessera, memory packaging and testing service provider...
Shenmao Technology, a solder bumping paste supplier, has announced consolidated revenues for January 2010 grew 8.27% sequentially and 132.06% on year to NT$534 million (US$17 million)...
Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...
