Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
Shenmao Technology plans to raise the prices of its solder bumping paste products by 10% to reflect the rising prices for solder, according to the company.
Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity to be three times its current level,...
Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...
Shenmao Technology, a solder bumping paste supplier, has said revenues for the second quarter are expected to hold level or grow from the first quarter. Revenues for the ongoing first...
Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...
Shenmao Technology, a solder bumping paste supplier, has announced consolidated revenues for January 2010 grew 8.27% sequentially and 132.06% on year to NT$534 million (US$17 million)...
Driver IC packaging and testing firm Chipbond Technology saw its monthly revenues hit a record of NT$640 million (US$19.5 million) in August, representing a 52.5% increase from NT$420...
Chipbond Technology is performing better than previously expected in the third quarter of 2009, thanks to growing demand from IDM customers, according to the company. The driver IC...
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
Solder prices have stayed around US$11,000 per ton for 3-4 months, helping increase electronic material supplier Shenmao Technology's gross margin. Shenmao expects to see better performance...
After dealing with rising raw material costs and exchange loss in the first quarter, Shenmao Technology, the number-one bumping solder paste supplier in Taiwan, had 272% sequential...
Shenmao Technology, a solder bumping paste supplier, started raising its average selling prices (ASPs) since March to reflect higher metal costs. The company has also decided not...
