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Tuesday 1 October 2024
How China is accelerating advanced packaging with HBM and CoWoS amid tightening US restrictions
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Tuesday 1 October 2024
TCL CSOT buys LGD Guangzhou site, strengthening China's TV panel dominance
LG Display (LGD) and TCL China Star Optoelectronics Technology (TCL CSOT) have signed an agreement for the latter to buy LGD's 8.5G LCD facility in Guangzhou for CNY10.8 billion (US$1.54...
Monday 30 September 2024
Taiwan pushes nuclear-free agenda amid growing energy demands
The Presidential Office has established the "National Climate Change Committee," comprising members from diverse backgrounds and areas of expertise. While divergent opinions are expected,...
Monday 30 September 2024
China's top OSATs invest big in advanced packaging to compete globally
China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying...
Friday 27 September 2024
AI PCs to drive battery module ASP
AI PCs will bring new opportunities to component manufacturers. Battery module manufacturer Simplo stated that due to AI PCs requiring larger battery capacity, the average selling...
Thursday 26 September 2024
Solar firm URE sees diversification bear fruit
United Renewable Energy (URE), a Taiwan-based manufacturer of solar cells and photovoltaic (PV) modules, has successfully diversified its portfolio by introducing new energy storage...
Thursday 26 September 2024
SK Hynix begins volume production of 12-layer HBM3E
K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...
Wednesday 25 September 2024
Innolux expands FOPLP focus beyond automotive, PMIC
Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.
Wednesday 25 September 2024
China-based solar companies undergo new wave of migration to avoid tariff barriers
A new round of US Section 301 sanctions will come into effect on the 27th, imposing a 50% tariff on Chinese-produced solar cells. These policies are compelling China-based solar companies...
Tuesday 24 September 2024
China automakers demand price cuts for SiC modules
China's automobile manufacturers are reportedly asking silicon carbide (SiC) module vendors to cut prices by as much as 30% amid growing supply, according to industry sources.
Monday 23 September 2024
Taiwan emerges as 'AI Cremona', but Quanta CTO urges beyond manufacturing
Taiwan has established itself as the global epicenter for generative AI hardware production, manufacturing 90% of the world's AI servers. TSMC, in particular, holds the exclusive...
Thursday 19 September 2024
Polarizer suppliers brace for panel output cutbacks
China-based panel manufacturers are set to implement a two-week production cut during the National Day holiday. Industry projections indicate that the average capacity utilization...
Wednesday 18 September 2024
CATL eyes solar-storage boom as M&A frenzy heats up
The solar industry has officially entered the N-type TOPCon era, but it now faces a significant supply glut. Recently, bargain hunting has emerged in the solar sector, signaling the...
Friday 13 September 2024
Samsung, SK Hynix, Micron to benefit from iPhone's memory upgrade
Apple's first AI phone, the iPhone 16 series, has officially been released. To adapt to Apple Intelligence, the entire series features 8GB of memory capacity. As AI functions become...
Friday 13 September 2024
MiTAC expands server production capacity to meet US data center demand
MiTAC Computing Technology (MCT), a subsidiary of MiTAC Holdings, has been actively expanding production capacity to meet the demands of US-based data center clients. After leasing...