China Resources Microelectronics (CR Micro) plans to hike pricing for power MOSFET and IGBT chips to reflect its fully utilized fab capacity, according to industry sources.
Samsung Electronics' HBM3E memory is in the final stages of its qualification test for a significant client, and shipments are expected to commence as early as August, according to...
India-based EMS giant Dixon Technologies doubled its sales and profits in the past quarter. The company anticipates a 10 million unit increase in smartphone production capacity following...
Specialty IC foundry Vanguard International Semiconductor (VIS) has successfully secured orders originally intended for Chinese competitors, despite the Chinese companies offering...
The world's top-3 memory chipmakers are likely to reduce their NAND flash memory capex in 2024, following two years of robust spending, according to industry sources.
Chinese foundries have prioritized orders from domestic customers, resulting in limited availability of fab capacity for others particularly Taiwan-based ones targeting the Chinese...
Nexchip is expanding into photomask production, aiming to achieve mass production by the fourth quarter. This move positions Nexchip as a full-service foundry, similar to TSMC and...
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
Inspur, a Chinese server manufacturer, recently denied a Reuters report, stating it has no collaboration with Nvidia on designing a B20 AI chip based on the Blackwell architecture...
Texas Instruments (TI) provided financial guidance that is slightly lower than expectations. The company's capital expenditure (Capex) plan is progressing smoothly, indicating significant...
NAND Flash memory suppliers are gearing up for robust demand driven by AI smartphones in the third quarter. Some sources suggest that production lines may already be experiencing...
