China-based panel manufacturers are set to implement a two-week production cut during the National Day holiday. Industry projections indicate that the average capacity utilization...
The solar industry has officially entered the N-type TOPCon era, but it now faces a significant supply glut. Recently, bargain hunting has emerged in the solar sector, signaling the...
Apple's first AI phone, the iPhone 16 series, has officially been released. To adapt to Apple Intelligence, the entire series features 8GB of memory capacity. As AI functions become...
MiTAC Computing Technology (MCT), a subsidiary of MiTAC Holdings, has been actively expanding production capacity to meet the demands of US-based data center clients. After leasing...
As Micro LED applications gain traction, PlayNitride is set for robust growth in the latter half of 2024. August marked a milestone with a record revenue of NT$184 million (US$5.89...
China-based Guangzhou Summit Crystal Semiconductor (GZSC) is seeking business opportunities in Taiwan, eyeing the potential of Taiwan's 8-inch SiC wafer fabrication.
To address evolving market and customer demands, Joinsoon Electronics Manufacturing Co Ltd is expediting its capacity transfer. The phase-two expansion at its Thailand facility has...
As Semicon India 2024 approaches, Tower Semiconductor and the Adani Group have announced a partnership to establish a wafer fab in Maharashtra, India. This strategic collaboration...
SEMICON Taiwan 2024 made its grand debut on the 4th. President of SK Hynix, Justin Kim, was invited to Taiwan and gave a keynote speech. He mentioned that to push AI technology towards...
Topco Scientific, a supplier of semiconductor materials, anticipates substantial sales growth for advanced packaging materials in 2025 due to demand generated by AI applications.
Intel has been dealing with ongoing losses and is reportedly exploring various cost-cutting measures and monetization strategies for its foundry services. Meanwhile, SMIC, which also...
Wah Lee Industrial, which distributes photoresist and CMP slurries, and other front-end process manufacturing materials, expects robust demand for CoWoS packaging to drive significant...
HBM4 memory will move toward integrating logic and memory processes to address greater power consumption issues and break performance constraints. Samsung Electronics and SK Hynix...
Six months ago, Intel CEO Pat Gelsinger introduced an ambitious "moonshot" initiative to match semiconductor manufacturing capacities in Europe and the US with those in Asia by 2030...
With major IC design houses like Intel, Apple, and Qualcomm launching new products amid rising electronics demand, TSMC's 3nm capacity utilization has consistently stayed at 100%,...
