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NEWS TAGGED CHIPBOND
Tuesday 21 May 2019
Taiwan IC partners see unclear prospects for 2H19 shipments to Huawei
With the US trade sanctions likely to prove disastrous to Huawei, Taiwan semiconductor supply chain partners can hardly give clear-cut prospects for the third quarter of 2019 and...
Friday 3 May 2019
Huawei demanding more COF substrate supply
Huawei has demanded more supplies from Taiwan-based chip-on-film (COF) substrate manufacturers including JMC Electronics and Chipbond Technology (formerly Simpal Electronics), and...
Thursday 11 April 2019
Chipbond to land COF packaging orders for 2019 LCD iPhone, say sources
Driver-IC backend firm Chipbond Technology is set to land COF packaging orders from Apple for a LCD-based iPhone device to be launched in 2019, allowing it to continue enjoying brisk...
Tuesday 9 April 2019
Backend firms see significant pickup in orders for TDDI chips
Backend houses have seen orders for handset-use TDDI (touch and display driver integration) chips ramp up significantly, prompting them to allocate part of their COF (chip on film)...
Tuesday 19 March 2019
COF substrate prices to rise 8-15% in 2Q19
COF substrate makers plan to adjust upward quotes for the second quarter by 8-15% sequentially to reflect their tight supplies, according to market sources.
Monday 25 February 2019
Development of foldable smartphones by non-Samsung players to benefit Taiwan supply chain
The planned launch of foldable smartphones by vendors other than Samsung Electronics such as Huawei and other Chinese brands, will benefit Taiwan's supply chain makers related to...
Monday 25 February 2019
Chipbond revenues to surge in 2Q19
Chipbond Technology, a backend house specializing in display driver ICs, is expected to see its revenues buck seasonal patterns in the first quarter of 2019 followed by robust performance...
Monday 28 January 2019
Taiwan firms gearing up for OLED market boom
With more LCD panel suppliers capable of producing in commercial volume OLED displays for smartphones, Taiwan-based driver IC firms and related backend houses are gearing up to grow...
Monday 28 January 2019
Huawei makes early preparations for 5G
As China's leading smartphone and telecom equipment maker, Huawei is moving at full throttles to strengthen its capabilities for the upcoming 5G commercialization era by placing orders...
Wednesday 9 January 2019
Chipbond, JMC post revenue growth in 2018
Chipbond Technology and JMC Electronics, both of whom are among the world's few suppliers of COF substrates, have reported revenue increases for 2018 of 16% and 45%, respectively.
Monday 19 November 2018
COF substrates have high entry barrier, says JMC chairman
The chip-on-film (COF) substrate market continues to be dominated by Korea- and Taiwan-based firms, and is considered to be niche with a high barrier of entry for startup companies,...
Thursday 1 November 2018
Chipbond posts record 3Q18 profit
LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...
Thursday 18 October 2018
Chipbond enters Huawei smartphone supply chain
Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources.
Wednesday 22 August 2018
Driver IC backend firms ink 3-year supply contracts
Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...
Wednesday 15 August 2018
Taiwan OSAT players keen on partnering with China IC firms
While China's semiconductor industry is aggressively moving to build partnerships with world-class players to strengthen its prowess amid the raging US-China trade war, Taiwan semiconductor...